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Marius van Dijk

Observed names: Dijk, Marius van, M. Van Dijk, M. van Dijk, M.v. Dijk, Marius Van Dijk, van Dijk, Marius
ORCID: 0000-0002-6438-6761
Observed ORCID: 0000-0002-6438-6761
OpenAlex ID: A5061392230
Combination of Experimental and Simulation Methods for Analysis of Sintered Ag Joints for High Temperature Applications
2016 · Constanze Weber, Hans Walter, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 42
Development of a Multi-project Fan-Out Wafer Level Packaging Platform
2017 · T. Braun, S. Raatz, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 35
Experimental and simulative study of warpage behavior for fan-out wafer-level packaging
2022 · Marius van Dijk, Saskia Huber, et al. · Microelectronics Reliability · 25
A Novel Packaging and System-Integration Platform with Integrated Antennas for Scalable, Low-Cost and High-Performance 5G mmWave Systems
2020 · Ivan Ndip, Kristoffer Andersson, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 15
Simulation challenges of warpage for wafer- and panel level packaging
2020 · Marius van Dijk, Simon Kuttler, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 13
Multiscale modeling of residual stresses in isotropic conductive adhesives with nano-particles
2012 · M. Erinc, M. van Dijk, et al. · Computational Materials Science · 10
Improving the FE simulation of molded packages using warpage measurements
2014 · S. Huber, M.v. Dijk, et al. · Microelectronics Reliability · 9
Reliability assessment of molded Smart Power Modules
2014 · T. Thomas, Karl‐Friedrich Becker, et al. · Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) · 8
Numerical simulation of transient thermomechanical ageing effects
2022 · Marius van Dijk, Saskia Huber, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 6
An approach for failure prediction in H3 TRB-tests
2019 · Elisabeth Kolbinger, Felix Wuest, et al. · European Microelectronics and Packaging Conference · 5
Warpage Investigation of PCB Embedding Technology – Determination of Relevant Modelling Parameters by Means of FEM and Experiments
2019 · Florian Rost, Saskia Huber, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 5
Influence of humidity on reliability of plastic packages
2015 · T. Braun, J. Bauer, et al. · Fraunhofer-Publica (Fraunhofer-Gesellschaft) · 5
Assessment of high temperature reliability of molded smart power modules
2014 · Tina Thomas, Karl-Friedrich Becker, et al. · Electronic System-Integration Technology Conference (ESTC) · 5
Improving Warpage Characterization of Large Wafers in Fan-Out Packaging Technology
2023 · Saskia Huber, Andreas Stegmaier, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 4
Modification of Prony Series Coefficients to Account for Thermo-Oxidative Ageing Effects within Numerical Simulations
2023 · Marius van Dijk, Olaf Wittler, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 4
Process Dependent Material Characterization for Warpage Control of Fan-Out Wafer Level Packaging
2021 · Olaf Wittler, Marius van Dijk, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 4
Residual stresses in isotropic conductive adhesives with nano-Ag particles
2012 · M. Erinc, M. van Dijk, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 4
Numerical simulation approach for consideration of ageing effects in PCB substrates by modifying viscoelastic materials properties
2024 · Marius van Dijk, Olaf Wittler, et al. · Microelectronics Reliability · 3
Warpage of Fan-Out Panel Level Packaging – Experimental and Numerical Study of Geometry and Process Influence
2023 · Andreas Stegmaier, Ole Hölck, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 3
Packaging Technologies and Challenges Towards 5G Integration of mm-wave Components and Silicon ICs
2023 · Tekfouy Lim, Michael Kaiser, et al. · River Publishers eBooks · 2
Finite Element Influence Analysis of Power Module Design Options
2022 · Marius van Dijk, Olaf Wittler, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 2
Study on FO-WLP Warpage Behavior – Influence of Process Temperature and Geometry
2021 · Marius van Dijk, Saskia Huber, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 2
Process Simulation of Fan-Out Wafer Level Packaging: Influence of Material and Geometry on Warpage
2020 · Marius van Dijk, Johannes Jaeschke, et al. · Electronic System-Integration Technology Conference (ESTC) · 2
Ferrites in Transfer-Molded Power SiPs: Challenges in Packaging
2020 · Tina Thomas, Marius van Dijk, et al. · Journal of Microelectronics and Electronic Packaging · 2
HOT-300 – A Multidisciplinary Technology Approach Targeting Microelectronic Systems at 300 °C Operating Temperature
2016 · Holger Vogt, Frank Altmann, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 2
Works count: 44
Citation count: 222
H-index: 8
I10-index: 6
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