Author

Charles Regard

Observed name: Regard, C

Institutions: Centre National de la Recherche Scientifique, Laboratoire de Cristallographie et Sciences des Matériaux

Observed institutions: NXP (Netherlands), Centre National de la Recherche Scientifique, Université de Bordeaux, NXP (Germany), Laboratoire de Cristallographie et Sciences des Matériaux, Laboratoire de l'Intégration du Matériau au Système, Université Bordeaux-I, NXP (France), Université de Caen Normandie

OpenAlex ID: A5062404157

Moisture diffusion model verification of packaging materials

2008 · Xiaosong Ma, K.M.B. Jansen, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 15

Fast reliability qualification of SiP products

2009 · Charles Regard, Christian Gautier, et al. · Microelectronics Reliability · 9

Influence of underfill methods on the solder joint fatigue of wafer level packaging

2008 · Charles Regard, Christian Gautier, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 5

Die attach interface property characterization as function of temperature using cohesive zone modeling method

2010 · Xiaosong Ma, G.Q. Zhang, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 4

Effect of aging of packaging materials on die surface cracking of a SiP carrier

2008 · Xiaosong Ma, K. M. B. Jansen, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 4

Simultaneous measures of temperature and expansion on electronic compound

2011 · Maxime Fontaine, Eric Joubert, et al. · Annual IEEE Semiconductor Thermal Measurement and Management Symposium/Proceedings · 3

Fast qualification using thermal shock combined with moisture absorption

2009 · Xiaosong Ma, G. Q. Zhang, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 2

Solder fatigue of Wafer Level package assemblies. Comparison with flip chip BGA’S

2008 · Charles Regard, Christian Gautier, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 2

Effect of aging of packaging materials on die surface cracking of a SiP carrier

2008 · Xu Ma, K.M.B. Jansen, et al. · TU/e Research Portal · 1

Qualification accélérée des composants SiP

2010 · Charles Regard · theses.fr (ABES)

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Moisture Diffusion Model Verification of Packaging Materials

2008 · Ma, XS, Jansen, KMB, et al. · TU/e Research Portal

Works count: 11

Citation count: 45

H-index: 4

I10-index: 1