Author

Erich Schlaffer

Observed name: E. Schlaffer

Institution: AT&S (Austria)

Observed institution: AT&S (Austria)

OpenAlex ID: A5063286375

Compact $X$ -Band Filter Based on Substrate Integrated Coaxial Line Stubs Using Advanced Multilayer PCB Technology

2016 · Mathieu Cariou, Benjamin Potelon, et al. · IEEE Transactions on Microwave Theory and Techniques · 43

Air-filled SIW technology for mass-manufacturable and energy-efficient terahertz systems

2023 · Laura Van Messem, Siddhartha Sinha, et al. · Scientific Reports · 10

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SIW Q-band filters using advanced multilayer PCB technology

2014 · S. Cadiou, C. Quendo, et al. · European Microwave Conference (EuMC) · 10

Modeling up to 45 GHz of coupling between microvias and PCB cavities considering several boundary conditions

2016 · Thierry Le Gouguec, Najib Mahdi, et al. · International Journal of Microwave and Wireless Technologies · 8

Optimized launching pads for investigating transmission line losses for different surface finishes of RF-PCBs up to 110 GHz

2015 · Oliver Huber, Thomas Faseth, et al. · IEEE MTT-S International Microwave and RF Conference (IMaRC) · 7

Characterization of printed circuit board materials & manufacturing technologies for high frequency applications up to 110 GHz

2015 · Oliver Huber, Thomas Faseth, et al. · The ... IEEE Annual Wireless and Microwave Technology Conference · 6

Experimental analysis of grounded coplanar waveguide structures based on different PCB processes with uncertainty analysis

2023 · Hiroaki Takahashi, Ziad Hatab, et al. · IEICE Electronics Express · 5

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Towards mass production of Air Filled Substrate Integrated Waveguides (AFSIW) for ultra-low loss, broadband radar applications

2022 · Heinrich Trischler, Siddhartha Sinha, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 4

Embedded Suspended Stripline Substrate Technology (ESSS) as a Catalyst for Low-loss PCB Structures in the Ka-Band

2019 · Sebastian W. Sattler, Ahmad Bader Alothman Alterkawi, et al. · IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP) · 4

Embedding of High Power RF Transistor Dies in PCB Laminate

2022 · Ioannis Peppas, Hiroaki Takahashi, et al. · European Microwave Conference (EuMC) · 3

Investigating the Impact of Final Finishes on the Insertion Loss in As Received and After Aging

2024 · Britta Schafsteller, Michael Schwaemmlein, et al. · IMAPSource Proceedings · 2

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Consistent and Cost-Effective PCB-Based D-Band Air-Filled Substrate-Integrated-Waveguide Filters

2024 · Laura Van Messem, Reinier Broucke, et al. · IEEE International Microwave Filter Workshop (IMFW) · 2

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Bandwidth Extension of a Doherty Power Amplifier Through Reduction of Packaging-Related Parasitic Effects

2023 · Ioannis Peppas, Hiroaki Takahashi, et al. · IEEE MTT-S International Microwave Symposium digest · 2

Air-filled cavity-backed 28 GHz Antenna array implemented by 2.5D PCB process and Network Analysis

2022 · H. Takahashi, S. W. Sattler, et al. · European Microwave Conference (EuMC) · 2

Sub-THz Transceiver Design for Future Generation Mobile Communications

2024 · G. Mangraviti, C. Dehos, et al. · River Publishers eBooks · 1

Experimental Characterization of Microvias Using TRL Calibration with Uncertainty Analysis

2022 · Hiroaki Takahashi, Ziad Hatab, et al. · Asia-Pacific Microwave Conference (APMC) · 1

Analysis of Quasi-Coaxial Via Implemented in IC Substrate using Multiple-Scattering Method

2024 · Hiroaki Takahashi, Pelin Suealp, et al. · River Publishers eBooks

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Uncertainty Quantification and Variance-Based Sensitivity Analysis for Microstrip Line on IC-Substrate

2024 · Hiroaki Takahashi, Hayato Kitagawa, et al. · International Conference on Broadband Communications for Next Generation Networks and Multimedia Applications (CoBCom)

先進多層PCB技術を用いた基板集積同軸線路スタブに基づく小型Xバンドフィルタ【Powered by NICT】

2017 · Cariou Mathieu, Benjamin Potelon, et al. · IEEE Transactions on Microwave Theory and Techniques

Alternative concepts for high speed, high frequency and signal integration into the PCB

2014 · Erich Schlaffer, Alain Le Fevre, et al.

Works count: 20

Citation count: 110

H-index: 6

I10-index: 3