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Emna Ben Romdhane

From early microstructural evolution to intergranular crack propagation in SAC solders under thermomechanical fatigue
2021 · E. Ben Romdhane, P. Roumanille, et al. · Microelectronics Reliability · 35
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Evaluation of thermomechanical fatigue lifetime of BGA lead-free solder joints and impact of isothermal aging
2021 · Pierre Roumanille, Emna Ben Romdhane, et al. · Microelectronics Reliability · 28
Impact of crystalline orientation of lead-free solder joints on thermomechanical response and reliability of ball grid array components
2020 · E. Ben Romdhane, A. Guédon-Gracia, et al. · Microelectronics Reliability · 24
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Early microstructural indicators of crack initiation in lead-free solder joints under thermal cycling
2021 · E. Ben Romdhane, P. Roumanille, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 14
La question de l’acceptation des outils de e-learning par les apprenants : quels dimensions et déterminants en milieu universitaire tunisien ?
2013 · Emna Ben Romdhane · Revue internationale des technologies en pédagogie universitaire · 13
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Using X-ray imaging for the study of crack development in solder reliability testing
2023 · P. Roumanille, J. Lesseur, et al. · Microelectronics Reliability · 8
Evaluation of SAC solder joint thermomechanical fatigue in different types of components
2022 · E. Ben Romdhane, P. Roumanille, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 7
Étude des pratiques d’utilisation d’une plate-forme pédagogique et analyse de leurs relations avec la satisfaction des étudiants à l’égard du système
2013 · Emna Ben Romdhane · Distances et médiations des savoirs · 6
QFN (Quad Flat No–lead) SAC Solder Joints under Thermal Cycling: Identification of Two Failure Mechanisms
2022 · E. Ben Romdhane, P. Roumanille, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 5
Damage evolution in thermal barrier coating under thermal gradient mechanical fatigue loading
2025 · Emna Ben Romdhane, Vincent Maurel, et al. · International Journal of Fatigue · 4
Microstructural approach to evaluate the reliability of lead-free electronic assemblies in thermomechanical fatigue
2022 · Emna Ben Romdhane · theses.fr (ABES) · 2
10.18162/ritpu.2013.223
2016 · Ben Romdhane, Emna · 2
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E-Learning in Higher Education
2013 · Emna Ben Romdhane · Advances in higher education and professional development book series · 2
The Customer Relationship Management at the Era of Smartphones: Study of the Project Mobile-Dinar within the Arab International Bank of Tunisia
2013 · Emna Ben Romdhane, Yosri Bouchioua · Advances in intelligent systems and computing · 1
Cognitive Indifference: Will Humanity Be Rendered Obsolete by Artificial Intelligence?
2026 · Mohamed Louadi, Emna Ben Romdhane · SSRN Electronic Journal
Works count: 17
Citation count: 151
H-index: 7
I10-index: 5
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