Author

John Chang

Observed names: J. Chang, J.F. Chang

Institution: Onto Innovation (United States)

Observed institutions: Analog Devices (United States), Onto Innovation (United States)

OpenAlex ID: A5074985670

Single-chip surface micromachined integrated gyroscope with 50°/h Allan deviation

2002 · J.A. Geen, S.J. Sherman, et al. · IEEE Journal of Solid-State Circuits · 268

Design Rules for a Reliable Surface Micromachined IC Sensor

1995 · S. Bart, J. Chang, et al. · IEEE International Reliability Physics Symposium proceedings · 24

Continuous self-calibration canceling drive-induced errors in MEMS vibratory gyroscopes

2015 · Igor P. Prikhodko, Carey Merritt, et al. · International Conference on Solid-State Sensors, Actuators and Microsystems · 13

In-run bias self-calibration for low-cost MEMS vibratory gyroscopes

2014 · Igor P. Prikhodko, Jeffrey A. Gregory, et al. · IEEE/ION Position Location and Navigation Symposium · 11

Extremely Large Exposure Field With Fine Resolution Lithography Technology To Enable Next Generation Panel Level Advanced Packaging

2021 · John Chang, Timothy Chang, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 8

Foplp Lithography Solutions to Overcome Die Placement Error, Predict Yield, Increase Throughput and Reduce Cost

2019 · Keith Best, John Chang, et al. · International Wafer Level Packaging Conference (IWLPC) · 8

Adaptive Shot Technology To Address Severe Lithography Challenges For Advanced FOPLP

2020 · John Chang, Keith Best, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 7

Analysis of Pattern Distortion by Panel Deformation and Addressing it by Using Extremely Large Exposure Field Fine-Resolution Lithography

2022 · John Chang, Corey Shay, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 6

High performance gyro with fast startup time, high range, wide bandwidth, low noise and excellent vibration immunity

2012 · Sheeba Gandhi Saraswathy, John Geen, et al. · IEEE/ION Position Location and Navigation Symposium · 5

Yield Prediction Technology a Game Changer for Cutting Costs and Reducing Ramp Time in FOPLP Lithography

2025 · John Chang, Keith. Best, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 4

Overlay Challenges of Extremely Large Exposure Field, Fine Resolution Lithography Due to Alignment Solution Errors and a Solution Using Early Zone Corrections in Advanced IC Substrates

2024 · John Chang, Xing Song, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 4

Advanced Outlier Die Control Technology in Fan-Out Panel Level Packaging Using Feedforward Lithography

2021 · John Chang, Jian Lu, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 3

From Pilot To HVM: A Practical Overlay Yield Prediction Workflow For FOPLP Lithography

2026 · John Chang, Jian Lu, et al. · International Conference on Electronics Packaging (ICEP) · 1

Advanced Post Overlay Compensation for Enhanced Lithography Overlay Accuracy for Next-Generation AICS Packaging

2025 · John Chang, Keith Best, et al. · International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) · 1

Early Zone Correction for Enhanced Overlay Precision in Next-Generation FOPLP Lithography

2025 · John Chang, Jian Lu, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference

Die-First FOPLP Lithography Challenges Due To Die Shifting And A Solution Using Feedforward Adaptive Shot Technology

2025 · John Chang, Jian Lu, et al. · IMAPSource Proceedings

PDF

Advanced Lithography Solutions to Address Extreme Die Shifts in Fan-Out Panel-Level Packaging

2024 · John Chang, Jian Lu, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference

Addressing Advanced IC Substrate Deformation and Pattern Distortion using an Extremely Large Exposure Field Fine-Resolution Lithography System

2024 · John Chang, Corey Shay, et al. · International Conference on Electronics Packaging (ICEP)

Using Outlier Control Technology with Feedforward Lithography to Address Die Shifting and Pattern Distortion Challenges in Fan-Out Panel-Level Packaging

2024 · John Chang, Jian Lu, et al. · IMAPSource Proceedings

PDF

Addressing Advanced IC Substrate Deformation and Pattern Distortion Using an Extremely Large Exposure Field Fine Fine-Resolution Lithography System

2023 · John Chang · IMAPSource Proceedings

PDF

FOPLP Lithography Solutions to Overcome Die Placement Error, Predict Yield, Increase Throughput and Reduce Cost

2019 · Keith Best, John Chang, et al. · Wafer-Level Packaging Symposium

Works count: 21

Citation count: 363

H-index: 7

I10-index: 4