Get started
Author

Fengman Liu

Observed names: Feng-man Liu, Fengman LIU, Fengman liu, Jiang-Tao Liu, Liu Fengman
Observed institutions: Chinese Academy of Sciences, Guizhou Minzu University, Institute of Microelectronics, Institute of Semiconductors, National Center for Advanced Packaging (China), University of Chinese Academy of Sciences
ORCID: 0000-0002-3579-1151
Observed ORCIDs: 0000-0002-3579-1151, 0000-0001-5134-3079
OpenAlex ID: A5075413332
Co-packaged optics (CPO): status, challenges, and solutions
2023 · Min Tan, Jiang Xu, et al. · Frontiers of Optoelectronics · 204
PDF
Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package
2017 · Fengze Hou, Tingyu Lin, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 86
Microchannel Thermal Management System With Two-Phase Flow for Power Electronics Over 500 W/cm2 Heat Dissipation
2020 · Fengze Hou, Hengyun Zhang, et al. · IEEE Transactions on Power Electronics · 41
Design of a PAM-4 VCSEL-Based Transceiver Front-End for Beyond-400G Short-Reach Optical Interconnects
2022 · Jian He, Donglai Lu, et al. · IEEE Transactions on Circuits and Systems I Regular Papers · 36
Thermo-mechanical reliability analysis of a RF SiP module based on LTCC substrate
2017 · Cheng Chen, Fengze Hou, et al. · Microelectronics Reliability · 25
High-sensitivity MEMS force and acceleration sensor based on graphene-induced non-radiative transition
2023 · Guanghui Li, Fengman Liu, et al. · Carbon · 24
PDF
Six-Degree-of-Freedom Posture Measurement Technologies Using Position Sensitive Detectors (PSDs): State of the Art
2022 · Xiangxu Meng, Siwei Sun, et al. · Micromachines · 20
PDF
Study on a Conformal Shielding Structure With Conductive Adhesive Coated on Molding Compound in 3-D Packages
2016 · Yi He, Jun Li, et al. · IEEE Transactions on Electromagnetic Compatibility · 18
Novel Low-Loss Fiber-Chip Edge Coupler for Coupling Standard Single Mode Fibers to Silicon Photonic Wire Waveguides
2021 · Siwei Sun, Ying Chen, et al. · Photonics · 17
PDF
Research on 3D Optical Module Integrating Edge Coupler and TSV
2022 · Qi Zheng, Peng Yang, et al. · Journal of Lightwave Technology · 16
Design and Realization of Multi-Channel and High-Bandwidth 2.5D Transmitter Integrated With Silicon Photonic MZM
2022 · Huimin He, Haiyun Xue, et al. · Journal of Lightwave Technology · 16
Deep dry etching of fused silica using C4F8/Ar inductively coupled plasmas
2016 · Laicun Lin, Xiangmeng Jing, et al. · Journal of Materials Science Materials in Electronics · 15
Efficient and scalable edge coupler based on silica planar lightwave circuits and lithium niobate thin films
2022 · Peng Yang, Siwei Sun, et al. · Optics & Laser Technology · 12
Integrated four-channel directly modulated O-band optical transceiver for radio over fiber application
2018 · Jun Liu, Yao Ye, et al. · Optics Express · 12
Thermal characterization of a novel 3D stacked package structure by CFD simulation
2016 · Cheng Chen, Delong Qiu, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 12
Crosstalk analysis and optimization of high-speed interconnections
2011 · Haidong Wang, Jian Song, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 10
Design and implementation of a rigid-flex RF front-end system-in-package
2016 · Peng Wu, Fengman Liu, et al. · Microsystem Technologies · 8
Design and implementation of a 700–2,600 MHz RF SiP module for micro base station
2014 · Yi He, Fengman Liu, et al. · Microsystem Technologies · 8
High-Bandwidth Lumped Mach-Zehnder Modulators Based on Thin-Film Lithium Niobate
2024 · Peng Yang, Siwei Sun, et al. · Photonics · 7
PDF
Thermal management of 3D RF PoP based on ceramic substrate
2014 · Fengze Hou, Fengman Liu, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 7
Enhanced Fabrication and Assembly of 3-D Chiplets Based on Active Interposer With Frontside Via-Last TSVs
2024 · Chengyi Liao, Huimin He, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 5
High Positional Resolution Pin-Cushion Position Sensitive Detector by Deliberately Introducing Barrel Distortion
2021 · Siwei Sun, Qi Zheng, et al. · IEEE Sensors Journal · 5
An electrical design and fabrication of a 12-channel optical transceiver with SiP packaging technology
2010 · Wei Gao, Zhihua Li, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 5
Thermal optimization of dual-sided embedded liquid cooling for high-power-density 3D HPC architectures
2025 · Yunting Liu, Rong Fu, et al. · Microelectronics Journal · 4
Multifunctional MEMS Sensors for Measuring Force and Acceleration Dependent on Graphene-Induced Nonradiative Transitions
2024 · Guanghui Li, Jiaqing Lv, et al. · ACS Applied Nano Materials · 4
Works count: 100
Citation count: 718
H-index: 13
I10-index: 17
Year
Topic
Type