Author

Antonio Orozco

Observed names: A. Orozco, Orozco, Antonio

Observed institutions: U.S. National Science Foundation, Neocera (United States), University of Maryland, College Park

OpenAlex ID: A5075572496

Identification of novel compositions of ferromagnetic shape-memory alloys using composition spreads

2003 · I. Takeuchi, O.O. Famodu, et al. · Nature Materials · 258

Pulsed-laser-deposited epitaxial Sr2FeMoO6−y thin films: Positive and negative magnetoresistance regimes

1999 · H. Asano, S. B. Ogale, et al. · Applied Physics Letters · 93

Oscillatory Exchange Coupling and Giant Positive Magnetoresistance in TiN/Fe3O4 Superlattices

1999 · A. Orozco, S. B. Ogale, et al. · Physical Review Letters · 52

High-throughput screening of magnetic properties of quenched metallic-alloy thin-film composition spreads

2007 · Jason R. Hattrick-Simpers, Cui Jun, et al. · Applied Surface Science · 19

Space Domain Reflectometry for open failure localization

2012 · Jan Gaudestad, Vladimir Talanov, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 17

A scanning SQUID microscope with 200 MHz bandwidth

2014 · Vladimir V Talanov, Nesco M Lettsome Jr, et al. · Superconductor Science and Technology · 14

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3D Magnetic Field Imaging for Non-Destructive Fault Isolation

2013 · A. Orozco, J. Gaudestad, et al. · Proceedings - International Symposium for Testing and Failure Analysis · 14

Advances in magnetic-based current imaging for high resistance defects and sub-micron resolution

2004 · L.A. Knauss, A. Orozco, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 14

Magnetic Field Imaging for Electrical Fault Isolation[1]

2019 · A. Orozco · ASM International eBooks · 13

Non-Destructive 3D Failure Analysis Work Flow for Electrical Failure Analysis in Complex 2.5D-Based Devices Combining 3D Magnetic Field Imaging and 3D X-Ray Microscopy

2018 · Antonio Orozco, Elena Talanova, et al. · Proceedings - International Symposium for Testing and Failure Analysis · 12

Failure analysis on resistive opens with Scanning SQUID Microscopy

2004 · S. Hsiung, K.V. Tan, et al. · IEEE International Reliability Physics Symposium proceedings · 12

Construction of a 3-D Current Path Using Magnetic Current Imaging

2007 · Frederick Felt, Lee Knauss, et al. · Proceedings - International Symposium for Testing and Failure Analysis · 11

Magnetic Field Imaging for non destructive 3D IC testing

2014 · J. Gaudestad, A. Orozco · Microelectronics Reliability · 10

Fault Isolation of High Resistance Defects Using Comparative Magnetic Field Imaging

2003 · Antonio Orozco, Elena Talanova, et al. · Proceedings - International Symposium for Testing and Failure Analysis · 8

Advances in scanning SQUID microscopy for die-level and package-level fault isolation

2003 · L.A. Knauss, A. Orozco, et al. · Microelectronics Reliability · 8

3D IC/Stacked Device Fault Isolation Using 3D Magnetic Field Imaging

2014 · A. Orozco, N.E. Gagliolo, et al. · Proceedings - International Symposium for Testing and Failure Analysis · 7

Failure Analysis Work Flow for Electrical Shorts in Triple Stacked 3D TSV Daisy Chains

2015 · J. Gaudestad, A. Orozco, et al. · IMAPSource Proceedings · 6

Magnetoresistive Sensors for Surface Scanning

2013 · D. C. Leitão, J. Borme, et al. · Smart sensors, measurement and instrumentation · 6

Localization of Dead Open in a Solder Bump by Space Domain Reflectometry

2012 · David P. Vallett, Daniel A. Bader, et al. · Proceedings - International Symposium for Testing and Failure Analysis · 6

Magnetic Current Imaging in Failure Analysis

2009 · Antonio Orozco · EDFA Technical Articles · 6

Magnetic field imaging and light induced capacitance alteration for failure analysis of Cu-TSV interconnects

2020 · Ingrid De Wolf, Kristof J.P. Jacobs, et al. · Microelectronics Reliability · 5

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Short localization in CPU FlipChip using thermal imaging and magnetic current imaging: Advanced fault isolation technique comparison

2015 · Jan Gaudestad, Antonio Orozco, et al. · IEEE International Reliability Physics Symposium proceedings · 3

Failure Analysis Work Flow for Electrical Shorts in Triple Stacked 3D TSV Daisy Chains

2014 · J. Gaudestad, A. Orozco, et al. · Proceedings - International Symposium for Testing and Failure Analysis · 3

DC SQUID RF magnetometer with 200 MHz bandwidth

2012 · Vladimir I Talanov, Nesco Lettsome, et al. · Bulletin of the American Physical Society · 3

Magnetic Current Imaging using multi path analysis for power short localization

2015 · Jan Gaudestad, Antonio Orozco, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 2

Works count: 40

Citation count: 613

H-index: 11

I10-index: 13