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Author

Roman Holly

Observed names: R Holly, R. Holly
Institution: EV Group (Austria)
OpenAlex ID: A5076147175
Particle manipulation using 3D ac electro-osmotic micropumps
2008 · W Hilber, B Weiss, et al. · Journal of Micromechanics and Microengineering · 16
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Dielectrophoretic particle dynamics in alternating-current electro-osmotic micropumps
2008 · Bernhard Weiss, Wolfgang Hilber, et al. · Applied Physics Letters · 14
Fabrication of silicon vertical taper structures using KOH anisotropic etching
2006 · Roman Holly, Kurt Hingerl · Microelectronic Engineering · 13
Si rib waveguide photodetector with an ordered array of Ge islands for 15 μm
2009 · Ventsislav Lavchiev, Roman Holly, et al. · Optics Letters · 11
Density-dependent particle separation in microchannels using 3D AC-driven electro-osmotic pumps
2009 · W. Hilber, B. Weiss, et al. · Sensors and Actuators A Physical · 10
Fabrication of silicon 3D taper structures for optical fibre to chip interface
2007 · Roman Holly, Kurt Hingerl, et al. · Microelectronic Engineering · 8
Optimization of PI & PBO Layers Lithography Process for High Density Fan-Out Wafer Level Packaging & Next Generation Heterogeneous Integration Applications Employing Digitally Driven Maskless Lithography
2022 · Thomas Uhrmann, Boris Povazay, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 6
Exploring Capabilities of Maskless Lithography for Dual—Image Exposure in FO WLP
2023 · Ksenija Varga, Thomas Uhrmann, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 5
Advanced Fan-Out Panel Level Packaging via Digital Lithography Patterning Development for AI Devices
2025 · Ksenija Varga, Roman Holly, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 3
Ultra High Density RDL Patterning of High–Resolution Dielectrics by Maskless Exposure Technology for High Performance Computing and Artificial Intelligence
2024 · Ksenija Varga, Thomas Uhrmann, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 3
Maskless exposure of die annotations and image sensor patterns employing 7th generation RGB resists
2024 · Ksenija Varga, Martin Weinhart, et al. · SPIE Novel Patterning Technologies · 3
Maskless Lithography Optimized for Heterogeneous and Chiplet Integration
2020 · B. Matuskova, B. Povazay, et al. · International Wafer Level Packaging Conference (IWLPC) · 3
Digital Lithography for Advanced Packaging and Heterogenous Integration
2022 · B. Dielacher, S. Schmolzer, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 2
Digitally driven maskless lithography optimized for fine pitch RDL and next generation devices
2022 · Bozena Matuskova, Thomas Uhrmann, et al. · SPIE Novel Patterning Technologies · 2
Innovative Digital Patterning by LITHOSCALE® XT for UHD FO WLP and HD PLP Required in 3D Integration
2025 · Ksenija Varga, Roman Holly, et al. · IMAPSource Proceedings · 1
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Droplet and particle manipulation in emulsions and suspensions using 3D electro-osmotic micropumps
2008 · W. Hilber, B. Weiss, et al. · IEEE International Conference on Micro Electro Mechanical Systems (MEMS) · 1
Advantages of Digital Lithography in Patterning of UHD FOWLP Utilizing Novel PI Dielectrics
2024 · K. Varga, R. Holly, et al. · IEEE Electronics Packaging Technology Conference (EPTC)
Traceability in automotive enabled by digital lithography
2024 · Ksenija Varga, Martin Weinhart, et al. · European Mask and Lithography Conference (EMLC)
Semiconductor Traceability: Die Annotations Patterning by Maskless Exposure Technology
2024 · K. Varga, R. Holly, et al. · International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA)
LITHOSCALE features accomplish dual exposure and high-resolution patterning
2023 · Ksenija Varga, Thomas Uhrmann, et al. · European Mask and Lithography Conference (EMLC)
Maskless Lithography Optimized for Heterogeneous and Chiplet Integration
2020 · B. Matuskova, B. Považay, et al. · Wafer-Level Packaging Symposium
Advanced Black Resist Processing and Optimized Lithographic Patterning for Novel Photonic Devices
2019 · B. Matuskova, H. Taguchi, et al. · International Wafer Level Packaging Conference (IWLPC)
Fabrication of Silicon Vertical Taper Structures for Fiber to Chip Coupler by KOH Anisotropic Etching
2006 · Roman Holly, Kurt Hingerl, et al.
Works count: 23
Citation count: 101
H-index: 6
I10-index: 5
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