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Edith Steinhäuser

Observed names: E. Steinhaeuser, E. Steinhauser, E. Steinhäuser, Edith Steinhaeuser, Edith Steinhauser, Steinhaeuser Edith
Institution: Atotech (Germany)
ORCID: 0000-0003-0996-9611
Observed ORCID: 0000-0003-0996-9611
OpenAlex ID: A5077303682
The effect of Ni on the kinetics of electroless Cu film deposition
2017 · Eric Logan, Tanu Sharma, et al. · Thin Solid Films · 21
Nanovoid Formation at Cu/Cu/Cu Interconnections of Blind Microvias: A Field Study
2019 · T. Bernhard, L. Gregoriades, et al. · IMAPSource Proceedings · 12
Potential low‐cost palladium‐alternatives for activating electroless copper deposition
2010 · Edith Steinhäuser · Circuit World · 12
Nickel dependence of hydrogen co-deposition and nanoporosity in electrolessly deposited Cu-films
2020 · Tobias Bernhard, Edith Steinhauser, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 6
Cu Recrystallization and the Formation of Epitaxial and Non-Epitaxial Cu/Cu/Cu Interfaces in Stacked Blind Micro Via Structures
2021 · T. Bernhard, S. Dieter, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 5
The Effect of Cu Target Pad Roughness and Solution Flow on the Growth Mode and Void Formation in Electroless Cu Films
2021 · Tobias Bernhard, Sebastian Zarwell, et al. · Journal of Microelectronics and Electronic Packaging · 3
The Effect of Cu Target Pad Roughness on the Growth Mode and Void Formation in Electroless Cu Films
2019 · Tobias Bernhard, Sebastian Zarwell, et al. · International Wafer Level Packaging Conference (IWLPC) · 3
Chemical “kick start” for the autocatalytic formaldehyde‐free electroless copper plating process
2010 · Edith Steinhäuser, Lutz Stamp, et al. · Circuit World · 3
A Predictive Metallographic Means to Identify The Relative Risk of Failure for Plated Micro Vias
2023 · Tobias Bernhard, Roger Massey, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 2
Plating and Recrystallization of Galvanic Cu Films on Roll Annealed and Polycrystalline Cu Foils and the Effect of Intermediate Electroless Cu Layers
2022 · T. Bernhard, R. Massey, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 2
Hydrogen Embrittlement and Nano Void Classification within Electroless Copper Deposits
2020 · T. Bernhard, E. Steinhauser, et al. · International Wafer Level Packaging Conference (IWLPC) · 2
Novel formaldehyde-free electroless copper for plating on next-generation substrates
2018 · Christian Wendeln, Edith Steinhäuser, et al. · IMAPSource Proceedings · 2
In-Situ Stress Determination of Electroless Cu on PCB-Relevant Substrates
2018 · Tobias Bernhard, Ralf Bruning, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 2
Smart Electroless Copper Bath for SAP Applications
2023 · Stefanie Manuela Bremmert, Sascha Dieter, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 1
Hydrogen Embrittlement Suppressors for Nickel-Free Electroless Copper Baths
2022 · Tobias Bernhard, Stefanie Manuela Bremmert, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 1
The effect of Cu target pad roughness on the growth mode and void formation in electroless Cu films
2020 · Tobias Bernhard, Sebastian Zarwell, et al. · IMAPSource Proceedings · 1
Novel Formaldehyde-Free Electroless Copper for Plating on Next Generation Substrates
2019 · Christian Wendeln, Edith Steinhäuser, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 1
Cost-Effective Alternatives to Palladium Activation – A Study on Autocatalytic Electroless Copper Deposition
2010 · Edith Steinhäuser, T.A. Magaya · IMAPSource Proceedings · 1
A Modular Electroless Copper Bath System for SAP Applications
2025 · Tobias Bernhard, André Beyer, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference
Copper Crystal Structures in Plated Microvias. Their Recrystallisation and a Means to Identify Joints at Risk of Premature Failure
2021 · T. Bernhard, R. Massey, et al. · International Symposium on Microelectronics
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Hydrogen Embrittlement and Nano Void Classification Within Electroless Copper Deposits
2020 · T. Bernhard, E. Steinhäuser, et al. · Wafer-Level Packaging Symposium
The Effect of Cu Target Pad Roughness on the Growth Mode and Void Formation in Electroless Cu Films
2019 · Tobias Bernhard, Sebastian Zarwell, et al. · Wafer-Level Packaging Symposium
無電解Cu膜析出の速度論に及ぼすNiの影響【Powered by NICT】
2017 · Logan Eric, Tanu Sharma, et al. · Thin Solid Films
Works count: 23
Citation count: 80
H-index: 5
I10-index: 3
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