Get started
Author

Yoav Grauer

Institution: KLA (Israel)
Observed institution: KLA (Israel)
OpenAlex ID: A5083766657
On product overlay metrology challenges in advanced nodes
2020 · Andrei V. Shchegrov, Philippe Leray, et al. · Metrology, Inspection, and Process Control XXXVI · 22
Active gated imaging for automotive safety applications
2015 · Yoav Grauer, Ezri Sonn · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 18
Optical overlay metrology trends in advanced nodes
2022 · Shlomit Katz, Yoav Grauer, et al. · Metrology, Inspection, and Process Control XXXVI · 14
Active gated imaging in driver assistance system
2014 · Yoav Grauer · Advanced Optical Technologies · 14
RGB-NIR active gated imaging
2016 · Nick Spooren, Bert Geelen, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 11
Overlay challenges in 3D heterogeneous integration
2022 · Yoav Grauer, Andy Miller, et al. · Metrology, Inspection, and Process Control XXXVI · 10
Accuracy enhancement in imaging based overlay metrology by optimizing measurement conditions per layer
2021 · Shlomit Katz, Yoav Grauer, et al. · Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV · 8
OPO improvements by moiré effect-based imaging
2023 · Yonglei Li, Justin Lim, et al. · Metrology, Inspection, and Process Control XXXVI · 7
Advanced overlay metrology for CIS bonding applications
2023 · Florent Dettoni, Emilie Deloffre, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 6
Small pitch overlay imaging metrology targets for tight OPO control
2024 · Nikhil Aditya Kumar Roy, Richard Housley, et al. · Metrology, Inspection, and Process Control XXXVI · 5
OPO reduction by novel target design
2020 · Zephyr Liu, Eitan Hajaj, et al. · Metrology, Inspection, and Process Control XXXVI · 5
Machine learning for modeled-TIS and overlay reduction
2020 · Shlomit Katz, Boaz Ophir, et al. · Metrology, Inspection, and Process Control XXXVI · 5
Artificial intelligence measurement in imaging-based overlay metrology for performance boost
2024 · Sveta Grechin, Shlomit Katz, et al. · Metrology, Inspection, and Process Control XXXVI · 4
OPO robustness and measurability improvement via extended wavelengths
2023 · Shlomit Katz, Nikhil Aditya Kumar Roy, et al. · Metrology, Inspection, and Process Control XXXVI · 4
Advanced overlay metrology for 3D NAND bonding applications
2023 · Yoav Grauer, Shlomo Eisenbach, et al. · Metrology, Inspection, and Process Control XXXVI · 3
Process optimization by virtual target design in overlay metrology
2022 · Xiaolei Liu, Yoav Grauer, et al. · Metrology, Inspection, and Process Control XXXVI · 3
High voltage scanning electron microscope overlay metrology accuracy for after development inspection
2021 · Slawomir Czerkas, Nadav Gutman, et al. · Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV · 3
Advanced processing control for wafer-to-wafer hybrid bonding
2024 · Nikhil Aditya Kumar Roy, Richard Housley, et al. · Metrology, Inspection, and Process Control XXXVI · 2
Laser safety approach in driver assistance system
2013 · Yoav Grauer · International Laser Safety Conference (ILSC) · 2
Overview for Overlay Metrology Challenges and Solutions in Advanced Packaging
2025 · Roie Volkovich, Nimrod Bar-Yaakov, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 1
OPO residuals improvement with imaging metrology for 3D NAND
2020 · Shlomit Katz, Anna Golotsvan, et al. · Metrology, Inspection, and Process Control XXXVI · 1
Optical overlay metrology challenges in next-gen semiconductor nodes
2026 · Shlomit Katz, Philippe Leray, et al. · Metrology, Inspection, and Process Control XXXVI
From metrology to control: a comprehensive overlay solution for IC manufacturing and packaging challenges
2025 · Chin-Chou Kevin Huang, Yoav Grauer, et al. · International Workshop on Advanced Patterning Solutions (IWAPS)
OPO Reduction by Imaging Signal Optimization in an Advanced Memory Device Process
2023 · Nahee Park, Yuqian Zhang, et al. · ASMC proceedings
Robustness improvement in imaging based overlay metrology for high topography layers by Talbot targets
2021 · Brian Watson, Shlomit Katz, et al. · Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV
Works count: 28
Citation count: 159
H-index: 8
I10-index: 6
Year
Topic
Type