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Gerald Mittendorfer

Observed name: G. Mittendorfer
OpenAlex ID: A5084124198
Adhesive wafer bonding for MEMS applications
2003 · Viorel Dragoi, Thomas Glinsner, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 53
Wafer-level plasma activated bonding: new technology for MEMS fabrication
2007 · Viorel Dragoi, Gerald Mittendorfer, et al. · Microsystem Technologies · 46
CMOS: compatible wafer bonding for MEMS and wafer-level 3D integration
2012 · Viorel Dragoi, Eric Pabo, et al. · Microsystem Technologies · 35
Metal Thermocompression Wafer Bonding for 3D Integration and MEMS Applications
2010 · Viorel Dragoi, Gerald Mittendorfer, et al. · ECS Transactions · 28
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CMOS wafer bonding for back-side illuminated image sensors fabrication
2010 · V. Dragoi, A. Filbert, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 9
Wafer Bonding for Backside Illuminated CMOS Image Sensors Fabrication
2010 · Viorel Dragoi, Gerald Mittendorfer, et al. · MRS Proceedings · 8
Adhesive Wafer Bonding Applied for Fabrication of True-Chip-Size Packages for SAW Devices
2013 · Thorsten Heuser, Christian Bauer, et al. · ECS Transactions · 7
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Reversible wafer bonding for reliable compound semiconductor processing
2003 · V. Dragoi, T. Glinsner, et al. · CAS proceedings · 7
Adhesive Wafer Bonding with SU-8 Intermediate Layers for Microfluidic Applications
2006 · Viorel Dragoi, Gerald Mittendorfer, et al. · ECS Transactions · 6
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CMOS-compatible aligned fusion wafer bonding
2011 · V. Dragoi, G. Mittendorfer, et al. · CAS proceedings · 3
Metal Wafer Bonding for MEMS Applications
2008 · Viorel Dragoi, Gerald Mittendorfer, et al. · MRS Proceedings · 3
Aligned Low Temperature Wafer Bonding for MEMS Manufacturing: Challenges and Promises
2007 · Viorel Dragoi, Thorsten Matthias, et al. · MRS Proceedings · 3
Wafer bonding for CMOS integration and packaging
2012 · V. Dragoi, F. Kurz, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 2
Plasma-activated wafer bonding: the new low-temperature tool for MEMS fabrication
2007 · V. Dragoi, G. Mittendorfer, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2
Adhesive Wafer Bonding with SU-8 Intermediate Layers for Microfluidic Applications
2006 · Viorel Dragoi, Gerald Mittendorfer, et al. · ECS Meeting Abstracts · 2
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Wafer bonding for vacuum encapsulated MEMS
2013 · V. Dragoi, M. Pawlak, et al. · CAS proceedings · 1
Adhesive Wafer Bonding Applied for Fabrication of True-Chip-Size Packages for SAW Devices
2012 · Thorsten Heuser, Christian Bauer, et al. · ECS Meeting Abstracts · 1
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Copper-oxide reduction for low-temperature wafer bonding
2012 · B. Rebhan, S. Tollabimazraehno, et al. · International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) · 1
Wafer bonding for MEMS and CMOS integration
2011 · V. Dragoi, E. Pabo, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 1
Effect of Process Variables on Glass Frit Wafer Bonding in MEMS Wafer Level Packaging
2008 · John Maloney, Srinivasan Sridharan, et al. · ECS Meeting Abstracts · 1
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III/V Wafer Bonding Technology for Wafer-Level Fabrication of GaInAsP/InP Microring Resonators
2006 · V. Dragoi, G. Mittendorfer, et al. · CAS proceedings · 1
300mm Wafer-Level Image Sensor Packaging
2011 · Thorsten Matthias, Bioh Kim, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)
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Investigations on Physical Processes for Low Temperature Plasma Activated Wafer Bonding
2010 · Thomas Plach, Kurt Hingerl, et al. · ECS Meeting Abstracts
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Metal Thermocompression Wafer Bonding for 3D Integration and MEMS Applications
2010 · Viorel Dragoi, Gerald Mittendorfer, et al. · ECS Meeting Abstracts
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Wafer Bonding of Plasma Activated Surfaces
2008 · Thomas Plach, Viorel Dragoi, et al. · ECS Transactions
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Works count: 32
Citation count: 220
H-index: 7
I10-index: 4
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