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S. Russo

Observed name: Sebastiano Russo
ORCID: 0000-0001-8142-2050
Observed ORCID: 0000-0001-8142-2050
OpenAlex ID: A5089508715
A Reliability Model for Power MOSFETs Working in Avalanche Mode Based on an Experimental Temperature Distribution Analysis
2011 · Antonio Testa, Salvatore De Caro, et al. · IEEE Transactions on Power Electronics · 71
Motor Overvoltage Mitigation on SiC MOSFET Drives Exploiting an Open-End Winding Configuration
2019 · Salvatore De Caro, Salvatore Foti, et al. · IEEE Transactions on Power Electronics · 42
Fast thermal fatigue on top metal layer of power devices
2002 · Sebastiano Russo, Romeo Letor, et al. · Microelectronics Reliability · 41
Stress analysis and lifetime estimation on power MOSFETs for automotive ABS systems
2008 · A. Testa, S. De Caro, et al. · IEEE Power Electronics Specialists Conference (PESC) · 32
Reliability enhancement with the aid of transient infrared thermal analysis of smart Power MOSFETs during short circuit operation
2005 · A. Irace, G. Breglio, et al. · Microelectronics Reliability · 28
Thermal Analysis Approach for Predicting Power Device Lifetime
2019 · Sebastiano Russo, Gaetano Bazzano, et al. · IEEE Transactions on Device and Materials Reliability · 21
Study of the Thermomechanical Strain Induced by Current Pulses in SiC-Based Power MOSFET
2021 · Laura Anoldo, Claudia Triolo, et al. · IEEE Electron Device Letters · 20
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Over-voltage mitigation on SiC based motor drives through an open end winding configuration
2017 · S. De Caro, S. Foti, et al. · IEEE Energy Conversion Congress and Exposition (ECCE) · 19
Fast transient thermomechanical stress to set a pressure-assisted sintering process
2019 · Marco Santopa, Sebastiano Russo, et al. · Conference on Ph.D. Research in Microelectronics and Electronics · 16
Reliability Assessment of Power MOSFETs Working in Avalanche Mode Based on a Thermal Strain Direct Measurement Approach
2015 · Sebastiano Russo, Antonio Testa, et al. · IEEE Transactions on Industry Applications · 16
Fast transient infrared thermal analysis of smart Power MOSFETS in permanent short circuit operation
2006 · G. Breglio, A. Irace, et al. · IEEE International Symposium on Power Semiconductor Devices and ICs/Proceedings of the International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices and ICs · 16
Numerical approach to predict power device reliability
2018 · Alessandro Sitta, Sebastiano Russo, et al. · International Conference on Design & Technology of Integrated Systems in Nanoscale Era (DTIS) · 12
Reliability of planar, Super-Junction and trench low voltage power MOSFETs
2010 · A. Testa, S. De Caro, et al. · Microelectronics Reliability · 12
Life time prediction and design for reliability of Smart Power devices for automotive exterior lighting
2008 · R. Letor, S. Russo, et al. · 12
An integrated approach to optimize solder joint reliability
2020 · Alessandro Sitta, Sebastiano Russo, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 11
Reliability Assessment of Avalanche Mode Operating Power MOSFETs through Coffin Manson Law based Mathematical Models
2014 · G. Cannata, S. De Caro, et al. · International Symposium on Power Electronics, Electrical Drives, Automation and Motion (SPEEDAM) · 11
An Infrared Thermal Measuring System for Automotive Applications and Reliability Improvement
2011 · S. Panarello, S. Patane’, et al. · Lecture notes in electrical engineering · 7
Reliability model application for power devices using mechanical strain real time mapping
2016 · S. Panarello, F. Garesci, et al. · IEEE International Symposium on Power Semiconductor Devices and ICs/Proceedings of the International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices and ICs · 6
Molding Compounds Adhesion and Influence on Reliability of Plastic Packages for SiC-Based Power MOS Devices
2013 · Antonino Scandurra, Giuseppe Francesco Indelli, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 6
Multchip SiC-based compact module for automotive applications: A high speed thermal study
2022 · L. Anoldo, G. Malta, et al. · Microelectronics Reliability · 5
Reliability assessment of low-voltage MOSFETs driving inductive loads
2010 · A. Testa, S. De Caro, et al. · IEEE International Symposium on Industrial Electronics (ISIE) · 3
Reliability assessment of power MOSFETs working in avalanche mode based on a thermal strain direct measurement approach
2014 · S. Russo, A. Testa, et al. · IEEE Energy Conversion Congress and Exposition (ECCE) · 2
Thermal stress and mechanical strain real time mapping in Intelligent Power Switches device
2014 · S. Panarello, C. Triolo, et al. · IEEE International Symposium on Power Semiconductor Devices and ICs/Proceedings of the International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices and ICs · 2
Power Cycling Body Diode Current Flow on SiC MOSFET Device
2022 · Giovanni Corrente, Nella Bentivegna, et al. · IEEE International On-Line Testing Symposium (IOLTS)
High speed thermal mapping on six-pack SiC-based module for hybrid and electric vehicles
2022 · Giuliana Malta, Laura Anoldo, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Works count: 26
Citation count: 411
H-index: 12
I10-index: 16
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