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Na-Yeon Choi

Observed name: Na-yeon Choi
Institution: Dong-Eui University
Observed institution: Dong-Eui University
ORCID: 0000-0002-0635-2678
Observed ORCID: 0000-0002-0635-2678
OpenAlex ID: A5101555738
Design-Oriented Degradation Mapping and Hyperelastic Model-Switch Guidelines for Nitrile-Butadiene Rubber Seals
2025 · Na-Yeon Choi, Dong-Seok Kim, et al. · Polymers · 3
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A Benchmarking Study on IGBT Thermal-Electrical Performance Using Finite Element Analysis and Design of Experiments (DOE)
2025 · Na-Yeon Choi, Dong-Hyeon Kim, et al. · Journal of Electrical Engineering and Technology · 3
Terminal strength test of TO-220 packaged Schottky barrier diode using finite element method
2023 · Na-Yeon Choi, Sung-Uk Zhang · Microelectronics Reliability · 3
Numerical Evaluation of Thermal Resistance for Power MOSFET Packaged in Hermetic Method
2022 · Na-Yeon Choi, Sung-Uk Zhang · Journal of Electrical Engineering and Technology · 3
A Comparative Study of the Linear-elastic and Hyperelastic Models for Degradation of PLA Prepared using Fused Filament Fabrication
2020 · Na-Yeon Choi, Byoung-Chul Shin, et al. · Journal of the Korean Society of Manufacturing Process Engineers · 3
Numerical evaluation of radiation degradation for P-MOSFET power devices under total ionizing dose effect
2025 · Na-Yeon Choi, Sung-Uk Zhang · Microelectronics Reliability · 2
Numerical Study of GaN HEMT Devices with Variations in Wire Bonding and Die Bonding Using Finite Element Analysis
2024 · Na-Yeon Choi, Sung-Uk Zhang · The Transactions of The Korean Institute of Electrical Engineers · 2
Numerical Evaluation of P-Channel MOSFETs Depending on the TID Effect Using Electric-Thermal Analysis
2024 · Na-Yeon Choi, Sung-Uk Zhang · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 2
Numerical Analysis of Cu Clip and Al Wire Bonding for MOSFET Packaging
2024 · Na-Yeon Choi, Sung-Uk Zhang · The Transactions of The Korean Institute of Electrical Engineers · 2
Enhanced Simulation Accuracy and Design Optimization in Power Semiconductors Through Individual Aluminum Metallization Layer Modeling
2025 · Na-Yeon Choi, Sang-Gi Kim, et al. · Energies · 1
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Hazard Analysis Process Based on STPA Using SysML
2019 · Na-yeon Choi, Byong-gul Lee · Journal of Internet Computing and services · 1
Comparative FEA Analysis of Cu Clip and Al Wire Bonding in Power Discrete Packages
2025 · Na-Yeon Choi, Sung-Uk Zhang · European Microelectronics and Packaging Conference
Evaluation and Optimization of the Packaging Parameter Changes of GaN HEMT Through Electrical-Thermal-Structural and Electromagnetic Analysis
2025 · Na-Yeon Choi, Sung-Uk Zhang · The Transactions of The Korean Institute of Electrical Engineers
Optimized Design and Analysis of Bonding Wire in Power Modules Through Electric-Thermal-Structural and Electromagnetic Simulations
2025 · Na-Yeon Choi, Sung-Uk Zhang · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Works count: 14
Citation count: 25
H-index: 3
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