Author

Fengshun Wu

Observed names: Feng-Shun Wu, Feng-shun WU, Feng-shun Wu, Wu Feng-Shun, Wu Fengshun

Institutions: PLA Army Engineering University, State Key Laboratory of Materials Processing and Die & Mould Technology, Huazhong University of Science and Technology

Observed institutions: Loughborough University, City University of Hong Kong, Harbin Institute of Technology, Wuhan National Laboratory for Optoelectronics, Yancheng Institute of Technology, PLA Army Engineering University, State Key Laboratory of Materials Processing and Die & Mould Technology, Jiangsu Provincial Key Laboratory of New Environmental Protection, Jiangxi University of Science and Technology, Huazhong University of Science and Technology

ORCID: 0000-0001-7516-7727

Observed ORCID: 0000-0001-7516-7727

OpenAlex ID: A5101861192

Increasing flexural strength of CO2 cured cement paste by CaCO3 polymorph control

2023 · Fengshun Wu, Xujia You, et al. · Cement and Concrete Composites · 148

Microstructures and properties of new Sn–Ag–Cu lead-free solder reinforced with Ni-coated graphene nanosheets

2015 · Guang Chen, Fengshun Wu, et al. · Journal of Alloys and Compounds · 131

Production of vaterite via wet carbonation of carbide residue: Enhancing cement properties and CO2 sequestration

2024 · Yeqiang Zhou, Fengshun Wu, et al. · Cement and Concrete Composites · 84

An approach to improve compressive strength of cement paste at low temperature by carbonation curing

2022 · Lei Jiang, Qian Wu, et al. · Construction and Building Materials · 82

N, P co-doped graphene-supported monometallic nanoparticles for highly efficient hydrogen evolution by acid electrolysis of water

2024 · Fengshun Wu, Li Zeng, et al. · Journal of Materials Chemistry A · 81

Performance of Sn–3.0Ag–0.5Cu composite solder with TiC reinforcement: Physical properties, solderability and microstructural evolution under isothermal ageing

2016 · Guang Chen, Hao Peng, et al. · Journal of Alloys and Compounds · 75

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Effect of the size of carbon nanotubes (CNTs) on the microstructure and mechanical strength of CNTs-doped composite Sn0.3Ag0.7Cu-CNTs solder

2018 · Ze Zhu, Yan-Cheong Chan, et al. · Materials Science and Engineering A · 67

Hydrogen generation from the reaction of Al-based composites activated by low-melting-point metals/oxides/salts with water

2019 · Xu Guan, Zheng Zhou, et al. · Energy · 63

Effect of oxygen on microstructural coarsening behaviors and mechanical properties of Ag sinter paste during high-temperature storage from macro to micro

2020 · Chuantong Chen, Chanyang Choe, et al. · Journal of Alloys and Compounds · 58

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Effects of preparation method on the hydrolytic hydrogen production performance of Al-rich alloys

2019 · Xu Guan, Zheng Zhou, et al. · Journal of Alloys and Compounds · 49

Improving the mechanical performance of Sn57.6Bi0.4Ag solder joints on Au/Ni/Cu pads during aging and electromigration through the addition of tungsten (W) nanoparticle reinforcement

2016 · Yi Li, Kaiming Luo, et al. · Materials Science and Engineering A · 47

Experiment-based regional characterization of HAZ mechanical properties for laser welding

2015 · Chunhua Wei, Jing Zhang, et al. · The International Journal of Advanced Manufacturing Technology · 45

Phase segregation, interfacial intermetallic growth and electromigration-induced failure in Cu/In–48Sn/Cu solder interconnects under current stressing

2016 · Yi Li, Adeline B.Y. Lim, et al. · Journal of Alloys and Compounds · 38

Effect of CNTs and Ni coated CNTs on the mechanical performance of Sn57.6Bi0.4Ag BGA solder joints

2016 · Huayu Sun, Y.C. Chan, et al. · Materials Science and Engineering A · 38

Ag3Sn Compounds Coarsening Behaviors in Micro-Joints

2018 · Ye Tian, Ning Ren, et al. · Materials · 34

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Effects of fullerenes reinforcement on the performance of 96.5Sn–3Ag–0.5Cu lead-free solder

2015 · Guang Chen, Fengshun Wu, et al. · Materials Science and Engineering A · 32

Reliable single-phase micro-joints with high melting point for 3D TSV chip stacking

2020 · Ye Tian, Heng Fang, et al. · Journal of Alloys and Compounds · 31

Effects of vaterite and leachate solid residue prepared from magnesium slag on the performance of cement mortar

2024 · Fengshun Wu, Ji Qin, et al. · Construction and Building Materials · 29

Thermo-migration behavior of SAC305 lead-free solder reinforced with fullerene nanoparticles

2016 · Guang Chen, Li Liu, et al. · Journal of Materials Science · 28

Electromigration in eutectic In-48Sn ball grid array (BGA) solder interconnections with Au/Ni/Cu pads

2015 · Yi Li, Fengshun Wu, et al. · Journal of Materials Science Materials in Electronics · 27

Simulation of crack propagation in solder layer of IGBT device under temperature shock by viscoplastic phase field method

2023 · Kai Yang, Longzao Zhou, et al. · Engineering Fracture Mechanics · 23

Failure mechanisms of solder interconnects under current stressing in advanced electronic packages: An update on the effect of alternating current (AC) stressing

2018 · Ze Zhu, Yan-Cheong Chan, et al. · Microelectronics Reliability · 23

Diffusion barrier property of electroless Ni-W-P coating in high temperature Zn-5Al/Cu solder interconnects

2017 · Li Liu, Zhiwen Chen, et al. · Journal of Alloys and Compounds · 23

Influence of the aggregated Ag3Sn on the improvement of electromigration phenomenon in the doped Sn58Bi solder joints

2015 · Huayu Sun, Y. C. Chan, et al. · Journal of Materials Science Materials in Electronics · 23

Microstructural and mechanical integrity of Cu/Cu interconnects formed by self-propagating exothermic reaction methods

2014 · Wenbo Zhu, Fengshun Wu, et al. · Microelectronic Engineering · 22

Works count: 162

Citation count: 1,954

H-index: 23

I10-index: 51