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Steffen Lehmann
Observed names:
Lehmann, Steffen,
S Lehmann,
S. Lehmann
Institution:
GlobalFoundries (Germany)
Observed institutions:
GlobalFoundries (United States),
GlobalFoundries (Singapore),
GlobalFoundries (Germany),
Technische Universität Dresden
ORCID:
0000-0003-0665-6716
Observed ORCID:
0000-0003-0665-6716
OpenAlex ID:
A5102859024
A 22nm FDSOI Technology Optimized for RF/mmWave Applications
2018
·
S.N. Ong
, S. Lehmann
, et al.
·
Digest of papers - IEEE Radio Frequency Integrated Circuits Symposium
·
148
A computationally efficient physics-based compact bipolar transistor model for circuit Design-part I: model formulation
2006
·
M. Schroter
, S. Lehmann
, et al.
·
IEEE Transactions on Electron Devices
·
40
Back-gate effects on DC performance and carrier transport in 22 nm FDSOI technology down to cryogenic temperatures
2022
·
Hung-Chi Han
, Farzan Jazaeri
, et al.
·
Solid-State Electronics
·
36
PDF
A computationally efficient physics-based compact bipolar transistor model for circuit Design-part II: parameter extraction and experimental results
2006
·
S. Fregonese
, S. Lehmann
, et al.
·
IEEE Transactions on Electron Devices
·
28
Analytical Modeling of Cryogenic Subthreshold Currents in 22-nm FDSOI Technology
2023
·
Hung-Chi Han
, Zhixing Zhao
, et al.
·
IEEE Electron Device Letters
·
23
PDF
Design and Characterization of a Variable Gain D-Band LNA for Optimized Link Budgeting for a 6G Receiver in 22FDX
2023
·
Patrick James Artz
, Quang Huy Le
, et al.
·
IEEE Transactions on Microwave Theory and Techniques
·
20
SiGe HBT modeling for mm-wave circuit design
2015
·
Andreas Pawlak
, Steffen Lehmann
, et al.
·
IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM)
·
20
Characterization of the Static Thermal Coupling Between Emitter Fingers of Bipolar Transistors
2014
·
Steffen Lehmann
, Yves Zimmermann
, et al.
·
IEEE Transactions on Electron Devices
·
20
In-depth Cryogenic Characterization of 22 nm FDSOI Technology for Quantum Computation
2021
·
Hung-Chi Han
, Farzan Jazaeri
, et al.
·
Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon
·
19
PDF
Empirical Large-Signal Modeling of mm-Wave FDSOI CMOS Based on Angelov Model
2021
·
Quang Huy Le
, Dang Khoa Huynh
, et al.
·
IEEE Transactions on Electron Devices
·
18
HICUM/Level0 - a simplified compact bipolar transistor model
2003
·
M. Schroter
, S. Lehmann
, et al.
·
IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM)
·
18
22FDSOI device towards RF and mmWave applications
2021
·
Zhixing Zhao
, Steffen Lehmann
, et al.
·
IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)
·
17
A 22nm FDSOI Technology with integrated 3.3V/5V/6.5V RFLDMOS Devices for IOT SOC applications
2018
·
C. Schippel
, S. Lehmann
, et al.
·
IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference
·
15
Compact Layout and Bias-Dependent Base-Resistance Modeling for Advanced SiGe HBTs
2008
·
Michael Schroter
, Julia Krause
, et al.
·
IEEE Transactions on Electron Devices
·
15
The rectangular bipolar transistor tetrode structure and its application
2007
·
M. Schroter
, S. Lehmann
·
IEEE International Conference on Microelectronic Test Structures (ICMTS)
·
15
22FDX® fMAX Optimization through Parasitics Reduction and GM Boost
2019
·
Zhixing Zhao
, Steffen Lehmann
, et al.
·
European Solid-State Device Research Conference
·
14
RF-pFET in fully depleted SOI demonstrates 420 GHz FT
2017
·
Josef Watts
, Kumaran Sundaram
, et al.
·
Digest of papers - IEEE Radio Frequency Integrated Circuits Symposium
·
13
High-resistivity with PN interface passivation in 22 nm FD-SOI technology for low-loss passives at RF and millimeter-wave frequencies
2023
·
L. Nyssens
, M. Rack
, et al.
·
Solid-State Electronics
·
12
Reliability-Conscious MOSFET Compact Modeling with Focus on the Defect-Screening Effect of Hot-Carrier Injection
2021
·
Pratik B. Vyas
, Ninad Pimparkar
, et al.
·
IEEE International Reliability Physics Symposium proceedings
·
12
W-Band Noise Characterization with Back-Gate Effects for Advanced 22nm FDSOI mm-Wave MOSFETs
2020
·
Q. H. Le
, D. K. Huynh
, et al.
·
Digest of papers - IEEE Radio Frequency Integrated Circuits Symposium
·
12
A simple and accurate method for extracting the emitter and thermal resistance of BJTs and HBTs
2014
·
Andreas Pawlak
, Steffen Lehmann
, et al.
·
IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM)
·
12
Novel Approach to FDSOI Threshold Voltage Model Validated at Cryogenic Temperatures
2023
·
Hung-Chi Han
, Zhixing Zhao
, et al.
·
IEEE Access
·
11
PDF
Impact of substrate resistivity on spiral inductors at mm-wave frequencies
2022
·
Lucas Nyssens
, Martin Rack
, et al.
·
Solid-State Electronics
·
11
Scalable compact modeling for SiGe HBTs suitable for microwave radar applications
2011
·
S Lehmann
, M Weiss
, et al.
·
IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF)
·
11
22-nm FDSOI CMOS Noise Modeling and Analysis in mm-Wave Frequency Range
2023
·
Quang Huy Le
, Dang Khoa Huynh
, et al.
·
IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF)
·
10
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Works count:
65
Citation count:
727
H-index:
15
I10-index:
27
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