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Kaushik A. Kumar

Tantalum Nitride Films Grown by Inorganic Low Temperature Thermal Chemical Vapor Deposition Diffusion Barrier Properties in Copper Metallization
1999 · Alain E. Kaloyeros, Xiaomeng Chen, et al. · Journal of The Electrochemical Society · 82
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Challenges and mitigation strategies for resist trim etch in resist-mandrel based SAQP integration scheme
2015 · Nihar Mohanty, Elliott Franke, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 19
Manufacturability considerations for DSA
2014 · Richard A. Farrell, Erik R. Hosler, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 14
Co-optimization of lithographic and patterning processes for improved EPE performance
2017 · Mark J. Maslow, Vadim Timoshkov, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 11
Patterning with metal-oxide EUV photoresist: patterning capability, resist smoothing, trimming, and selective stripping
2017 · Ming Mao, Frederic Lazzarino, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 9
Self-aligned block technology: a step toward further scaling
2017 · Frédéric Lazzarino, Nihar Mohanty, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 8
Plasma etch patterning of EUV lithography: balancing roughness and selectivity trade off
2016 · Vinayak Rastogi, Genevieve Beique, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 7
Trench and hole patterning with EUV resists using dual frequency capacitively coupled plasma (CCP)
2015 · Yannick Feurprier, Katie Lutker-Lee, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 7
Dual frequency mid-gap capacitively coupled plasma (m-CCP) for conventional and DSA patterning at 10nm node and beyond
2014 · Nihar Mohanty, Akiteru Ko, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 6
Integration of chemical vapor deposition Al interconnects in a benzocyclobutene low dielectric constant polymer matrix: A feasibility study
2000 · Heidi Wickland, Robert Talevi, et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 6
Overcoming etch challenges related to EUV based patterning (Conference Presentation)
2017 · Andrew W. Metz, Hongyun Cottle, et al. · 5
Highly selective and precisely controlled aluminum etching by Ar/HBr/CH3F/O2 gas chemistry
2014 · Eiji Suzuki, Hiroto Ohtake, et al. · Japanese Journal of Applied Physics · 5
Plasma etch selectivity study and material screening for self-aligned gate contact (SAGC)
2019 · Dunja Radisic, Marc Demand, et al. · Advanced Etch Technology and Process Integration for Nanopatterning · 4
The Study of Modified Layers in SiCOH Dielectrics using Spectroscopic Ellipsometry
2003 · Marcus A. Worsley, Stacey F. Bent, et al. · MRS Proceedings · 4
Intra-field etch induced overlay penalties
2020 · Richard van Haren, Oktay Yildirim, et al. · Advanced Etch Technology and Process Integration for Nanopatterning · 3
Enabling complimentary FET (CFET) fabrication: selective, isotropic etch of Group IV semiconductors (Conference Presentation)
2019 · Subhadeep Kal, Yusuke Oniki, et al. · Advanced Etch Technology and Process Integration for Nanopatterning · 2
Co-optimization of exposure dose and etch process for SAQP pitch walk control
2018 · Mark J. Maslow, Vadim Timoshkov, et al. · SPIE Optical Microlithography · 2
Chapter 2 Transmission electron microscopy
2023 · Kaushik Kumar, Divya Zindani · De Gruyter eBooks · 1
On product overlay characterization after stressed layer etch
2021 · Richard van Haren, Orion Mouraille, et al. · Advanced Etch Technology and Process Integration for Nanopatterning · 1
Challenges in the Plasma Etch Process Development in the sub-20nm Technology Nodes
2013 · Kaushik Kumar · Bulletin of the American Physical Society
Plasma - Lithography Interactions and Challenges for 32nm and Beyond for Advanced Logic Devices
2009 · Kaushik A. Kumar, Habib Hichri, et al. · ECS Meeting Abstracts
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Low Temperature CVD Route to Binary and Ternary Diffusion Barrier Nitrides for Cu Metallization
1998 · Alain E. Kaloyeros, Jean Kelsey, et al. · MRS Proceedings
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Works count: 22
Citation count: 196
H-index: 7
I10-index: 4
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