Product
Help
Pricing
About
Jobs
Log in
Get started
Author
Add to collection
Chang-Chi Lee
Observed name:
Chang-chi Lee
Institution:
Advanced Semiconductor Engineering (Taiwan)
Observed institutions:
Advanced Semiconductor Engineering (Taiwan),
GlobalFoundries (United States),
National Formosa University,
National University of Formosa,
Feng Chia University
ORCID:
0000-0001-8214-4208
Observed ORCID:
0000-0001-8214-4208
OpenAlex ID:
A5108432302
An Overview of the Development of a GPU with Integrated HBM on Silicon Interposer
2016
·
Chang-Chi Lee
, Cp Hung
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
148
A Sub-1 ppm/°C Precision Bandgap Reference With Adjusted-Temperature-Curvature Compensation
2017
·
Hou-Ming Chen
, Chang-Chi Lee
, et al.
·
IEEE Transactions on Circuits and Systems I Regular Papers
·
130
Solder Joint Reliability Modeling by Sequential Artificial Neural Network for Glass Wafer Level Chip Scale Package
2020
·
Cadmus C. A. Yuan
, Chang-Chi Lee
·
IEEE Access
·
39
PDF
A High-Precision Bandgap Reference With a V-Curve Correction Circuit
2020
·
Chang-Chi Lee
, Hou-Ming Chen
, et al.
·
IEEE Access
·
34
PDF
Thermal–Mechanical Coupling Analysis for Coupled Power- and Thermal-Cycling Reliability of Board-Level Electronic Packages
2008
·
Yi-Shao Lai
, Tong Hong Wang
, et al.
·
IEEE Transactions on Device and Materials Reliability
·
22
2.5D IC Micro-Bump Materials Characterization and IMCs Evolution Under Reliability Stress Conditions
2016
·
Michael Su
, Bryan Black
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
21
Thermal characteristics evaluation for board-level high performance flip-chip package equipped with vapor chamber as heat spreader
2010
·
Tong Hong Wang
, Chang-Chi Lee
, et al.
·
Microelectronic Engineering
·
20
Study of factors affecting warpage of HFCBGA subjected to reflow soldering-liked profile
2012
·
Tong Hong Wang
, Ching-I Tsai
, et al.
·
Microelectronics Reliability
·
15
Transient Thermal Analysis for Board-Level Chip-Scale Packages Subjected to Coupled Power and Thermal Cycling Test Conditions
2005
·
Tong Hong Wang
, Chang-Chi Lee
, et al.
·
Journal of Electronic Packaging
·
13
Structural design guideline to minimize extreme low-k delamination potential in 40nm flip-chip packages
2012
·
Yi-Shao Lai
, Meng-Kai Shih
, et al.
·
Microelectronics Reliability
·
12
High-powered thermal gel degradation evaluation on board-level HFCBGA subjected to reliability tests
2011
·
Tong Hong Wang
, Hsuan-Yu Chen
, et al.
·
Microelectronic Engineering
·
11
Thermal-mechanical coupling analysis for coupled power and thermal cycling reliability of chip-scale packages
2005
·
Yi-Shao Lai
, Tong Hong Wang
, et al.
·
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
·
11
Board Level Power Cycling and Thermal Cycling Fatigue Reliability of Chip-scale Packages
2005
·
Tong Hong Wang
, Yi-Shao Lai
, et al.
·
Journal of Microelectronics and Electronic Packaging
·
9
Die-to-Wafer (D2W) Processing and Reliability for 3D Packaging of Advanced Node Logic
2019
·
Luke England
, Daniel Fisher
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
6
Implementation of a novel brushless DC motor controller
2017
·
Chang-Chi Lee
, Gwo-Jen Chiou
, et al.
·
IEEE Conference on Industrial Electronics and Applications (ICIEA)
·
6
Electrical, thermal and warpage investigation on high bandwidth PoP
2013
·
Mike Hung
, Chang-Chi Lee
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
6
Using a Flexible IoT Architecture and Sequential AI Model to Recognize and Predict the Production Activities in the Labor-Intensive Manufacturing Site
2021
·
Cadmus Yuan
, Chic-Chang Wang
, et al.
·
Electronics
·
5
PDF
Pesticide Residue Testing System for Fruits and Vegetables by Color Identification Technology
2019
·
Chang-Chi Lee
, Yu-Sung Liu
, et al.
·
IEEE International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan)
·
5
The physics of Cu pillar bump interconnect under electromigration stress testing
2014
·
Yu-Hsiang Hsiao
, Chien-Fan Chen
, et al.
·
Electronic System-Integration Technology Conference (ESTC)
·
5
On the thermal stability margins of high-leakage current packaged devices
2006
·
Chang-chi Lee
, Johannes de Groot
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
5
Effect of surface roughness of silicon die and copper heat spreader on thermal performance of HFCBGA
2011
·
Tong Hong Wang
, Sara N. Paisner
, et al.
·
Microelectronics Reliability
·
4
Lifetime study for solution processed organic light emitting diodes
2019
·
Fuh-Shyang Juang
, Chang-Chi Lee
, et al.
·
IOP Conference Series Materials Science and Engineering
·
3
PDF
Quantitative reliability prediction model for wafer level packages under board-level temperature cycling
2014
·
Hung-Chun Yang
, Chin-Li Kao
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
3
Next generation package-on-package solution to support wide IO and high bandwidth interface
2014
·
Hung-Hsiang Cheng
, Chang-Chi Lee
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
3
Micro-bump bondability design guidelines for high throughput 2.5D & 3D IC assemblies
2013
·
Chang-Lin Yeh
, Yung-Yi Yeh
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
3
Show more works
View as search
Works count:
41
Citation count:
547
H-index:
11
I10-index:
12
Year
Topic
Type
