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Henning Hubner

Observed names: H. Hubner, H. Hübner, Henning Hübner
Institution: Atotech (Germany)
OpenAlex ID: A5110257291
Three dimensional metallization for vertically integrated circuits
1997 · P. Ramm, D. Bollmann, et al. · Microelectronic Engineering · 91
Cu/Sn Solid–Liquid Interdiffusion Bonding
2008 · A. Munding, H. Hübner, et al. · Integrated circuits and systems · 30
Scaling aspects of microjoints for 3D chip interconnects
2006 · A. Munding, A. Kaiser, et al. · European Solid-State Device Research Conference · 9
Discussion in profile phenomena in sub-μM resist reactive ion etching
1989 · W. Pilz, H. Hübner, et al. · Microelectronic Engineering · 8
Adjustable EMI Shielding on Electronic Packages Realized by Electrolytic Plating
2019 · Mustafa Ozkok, Sven Lamprecht, et al. · IEEE CPMT Symposium Japan (ICSJ) · 5
Filling of Microvias and Through Holes by Electrolytic Copper Plating - Current Status and Future Outlook
2018 · Mustafa Ozkok, Sven Lamprecht, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 5
Eine Test- und Ansteuerschaltung für eine neuartige 3D Verbindungstechnologie
2005 · M. Bschorr, H.-J. Pfleiderer, et al. · Advances in radio science · 5
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Upscaling panel size for Cu plating on FOPLP (Fan Out Panel Level Packaging) applications to reduce manufacturing cost
2018 · Henning Hübner, Christian Ohde, et al. · IMAPSource Proceedings · 2
Influence of central profile distortions on the bandwidth of GRIN multimode fibers
1983 · P. Geittner, H. Hubner, et al. · Optical Fiber Communication Conference · 2
Pulse Reverse Electroplating for Copper Filling in High Aspect Ratio Through Glass Vias for Advanced Packaging
2025 · Dennis Fiedler, Grigory Vazhenin, et al. · IMAPSource Proceedings · 1
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Tool-Agnostic Pulse Reverse Electroplating for High Aspect Ratio Through Glass Vias in Advanced Packaging
2025 · Dennis Fiedler, Grigory Vazhenin, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 1
BMV filling in VCL for advanced IC substrates production
2014 · Henning Hubner, Olivier Mann, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 1
Three dimensional metallization for vertically integrated circuits
1998 · D. Bollmann, R. Braun, et al. · European Workshop Materials for Advanced Metallization, · 1
Innovative Electrolytic Flash Copper Plating Equipment for Enhanced mSAP Via Reliability and Efficiency
2025 · Mustafa Özkök, Andreas Schatz, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference
Driving Efficiency and Reliability in AI Hardware: Leading Edge Pulse Plating Solutions for Uniform Copper Deposition
2024 · Mustafa Özkýk, Akif Özkýk, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference
A Novel Horizontal Copper Pattern Plating System with High Throughput
2019 · Mustafa Ozkok, Andreas Schatz, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference
Progress in transfer of wafer level packaging to panel format
2017 · Henning Hubner, Christian Ohde, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference
Pattern copper through hole filling in VCP for IC substrate production
2017 · Henning Hubner, Olivier Mann, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference
Transfer of Wafer Level Packaging to Panel Format
2017 · Henning Hübner, Christian Ohde, et al. · Wafer-Level Packaging Symposium
Advanced via filling for improved within-unit distribution
2013 · Henning Hubner, Stephen Kenny, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference
Yield-improving test and routing circuits for a novel 3-D interconnect technology
2006 · M. Bschorr, H.-J. Pfleiderer, et al. · Advances in radio science
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Works count: 21
Citation count: 161
H-index: 5
I10-index: 2
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