Three dimensional metallization for vertically integrated circuits
Year: 1997
Type: article
Source: Microelectronic Engineering
Authors: P. Ramm, D. Bollmann, R. Braun, R. Buchner, U. Cao-Minh, M. Engelhardt, G. Errmann, T. Graßl, K. Hieber, H. Hübner, G. Kawala, M. Kleiner, A. Klumpp, S. Kühn, C. Landesberger, H. Lezec, W. Muth, W. Pamler, R. Popp, E. Renner, G. Ruhl, A. Sänger, U. Scheler, A. Schertel, C. Schmidt, S. Schwarzl, J. Weber, W. Weber
Institutions: Fraunhofer-Gesellschaft, Siemens (Germany)
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2154309229