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Ying-Ta Chiu

Alloying modification of Sn–Ag–Cu solders by manganese and titanium
2008 · Li-Wei Lin, Jenn-Ming Song, et al. · Microelectronics Reliability · 77
Electromigration of Sn–37Pb and Sn–3Ag–1.5Cu/Sn–3Ag–0.5Cu composite flip–chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy
2006 · Yi-Shao Lai, Kuo-Ming Chen, et al. · Microelectronics Reliability · 75
Electromigration Reliability and Morphologies of Cu Pillar Flip-Chip Solder Joints with Cu Substrate Pad Metallization
2008 · Yi-Shao Lai, Ying-Ta Chiu, et al. · Journal of Electronic Materials · 72
Nanomechanical responses of intermetallic phase at the solder joint interface – Crystal orientation and metallurgical effects
2011 · Jenn-Ming Song, Bo-Ron Huang, et al. · Materials Science and Engineering A · 61
Strain Rate Dependence on Nanoindentation Responses of Interfacial Intermetallic Compounds in Electronic Solder Joints with Cu and Ag Substrates
2009 · Jenn-Ming Song, Yu-Lin Shen, et al. · MATERIALS TRANSACTIONS · 41
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Low-temperature Cu-to-Cu bonding using silver nanoparticles stabilised by saturated dodecanoic acid
2014 · Wen-Hua Li, Pei-Syuan Lin, et al. · Materials Science and Engineering A · 32
Ball Impact Responses of Ni- or Ge-Doped Sn-Ag-Cu Solder Joints
2007 · Yi-Shao Lai, Jenn-Ming Song, et al. · Journal of Electronic Materials · 31
Electromigration reliability and morphologies of Cu pillar flip-chip solder joints
2008 · Yi-Shao Lai, Ying-Ta Chiu, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 27
Dissolution of Sn in a SnPb solder bump under current stressing
2012 · Ying-Ta Chiu, Kwang-Lung Lin, et al. · Journal of Applied Physics · 25
The Pd distribution and Cu flow pattern of the Pd-plated Cu wire bond and their effect on the nanoindentation
2012 · Yu-Wei Lin, Ren-You Wang, et al. · Materials Science and Engineering A · 24
Supersaturation induced by current stressing
2011 · Ying-Ta Chiu, Chia-Hao Liu, et al. · Scripta Materialia · 24
The influence of Pd on the interfacial reactions between the Pd-plated Cu ball bond and Al pad
2012 · Yu-Wei Lin, Wun-Bin Ke, et al. · Surface and Coatings Technology · 23
Influence of trace alloying elements on the ball impact test reliability of SnAgCu solder joints
2011 · Jenn-Ming Song, Yao-Ren Liu, et al. · Microelectronics Reliability · 23
Electrorecrystallization of Metal Alloy
2012 · Ying-Ta Chiu, Kwang-Lung Lin, et al. · Journal of Alloys and Compounds · 22
Current induced segregation of intermetallic compounds in three-dimensional integrated circuit microbumps
2017 · Chiao-Wen Chen, Tsung-Chieh Chiu, et al. · Intermetallics · 20
Enhanced Cu-to-Cu direct bonding by controlling surface physical properties
2017 · Po-Hao Chiang, Sin-Yong Liang, et al. · Japanese Journal of Applied Physics · 20
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Time-dependent deformation behavior of interfacial intermetallic compound layers in electronic solder joints
2010 · Jenn-Ming Song, Chien-Wei Su, et al. · Journal of materials research/Pratt's guide to venture capital sources · 17
Ball Impact Reliability of Zn-Sn High-Temperature Solder Joints Bonded with Different Substrates
2013 · Jenn-Ming Song, Meng-Ju Lin, et al. · Journal of Electronic Materials · 16
Light enhanced direct Cu bonding for advanced electronic assembly
2018 · Sin-Yong Liang, Jenn-Ming Song, et al. · Journal of Materials Science Materials in Electronics · 15
The corrosion behavior of Ag alloy wire bond on Al pad in molding compounds of various chlorine contents under biased-HAST
2016 · Ying-Ta Chiu, Tzu-Hsing Chiang, et al. · International Conference on Electronics Packaging (ICEP) · 14
Electromigration of 96.5Sn-3Ag-0.5Cu Flip-chip Solder Bumps Bonded on Substrate Pads of Au/Ni/Cu or Cu Metallization
2006 · Yi-Shao Lai, Chiu-Wen Lee, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 13
Electro-dissolution of the Bi second phase in Sn5Bi solder alloy
2015 · Tsung-Chieh Chiu, Ying-Ta Chiu, et al. · Materials Letters · 11
Electromigration reliability of redistribution lines in wafer-level chip-scale packages
2011 · Yi-Shao Lai, Chin-Li Kao, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 11
A comparison study of electromigration performance of Pb-free flip chip solder bumps
2009 · Peng Su, Li Li, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 11
Intermetallic formation induced substrate dissolution in electroless Ni(P)-solder interconnections
2008 · Jenn-Ming Song, Yao-Ren Liu, et al. · Journal of materials research/Pratt's guide to venture capital sources · 11
Works count: 56
Citation count: 785
H-index: 17
I10-index: 25
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