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Ping‐Feng Yang

Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition
2005 · Yi-Shao Lai, Ping-Feng Yang, et al. · Microelectronics Reliability · 182
Nanoindentation identifications of mechanical properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds derived by diffusion couples
2007 · Ping-Feng Yang, Yi-Shao Lai, et al. · Materials Science and Engineering A · 166
An Overview of the Development of a GPU with Integrated HBM on Silicon Interposer
2016 · Chang-Chi Lee, Cp Hung, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 148
Selective maltose hydrogenation to maltitol on a ternary Co–P–B amorphous catalyst and the synergistic effects of alloying B and P
2007 · Hui Li, Pingfeng Yang, et al. · Applied Catalysis A General · 93
Wafer Warpage Experiments and Simulation for Fan-Out Chip on Substrate
2016 · Yuan-Ting Lin, Wei-Hong Lai, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 90
A review of three-dimensional viscoelastic models with an application to viscoelasticity characterization using nanoindentation
2011 · Dao-Long Chen, Ping-Feng Yang, et al. · Microelectronics Reliability · 77
Effects of bolt pre-loading variations on performance of GDL in a bolted PEMFC by 3-D FEM analysis
2016 · Chi-Hui Chien, Yao-Lun Hu, et al. · Energy · 71
Characteristics of ZnO thin films prepared by radio frequency magnetron sputtering
2007 · Ping-Feng Yang, Hua-Chiang Wen, et al. · Microelectronics Reliability · 67
Molecular Dynamics Simulation of Nanoindentation-induced Mechanical Deformation and Phase Transformation in Monocrystalline Silicon
2008 · Yen-Hung Lin, Sheng-Rui Jian, et al. · Nanoscale Research Letters · 50
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Surface Morphological and Nanomechanical Properties of PLD-Derived ZnO Thin Films
2008 · Sheng-Rui Jian, I-Ju Teng, et al. · Nanoscale Research Letters · 44
Nanomechanical properties of Bi2Te3 thin films by nanoindentation
2014 · Cheng-Hsun Tasi, Yu-Chin Tseng, et al. · Journal of Alloys and Compounds · 35
Rapid, low temperature microwave synthesis of durable, superhydrophobic carbon nanotube–polybenzoxazine nanocomposites
2013 · Chih-Feng Wang, Hsuan-Yu Chen, et al. · RSC Advances · 33
Rice husk agricultural waste-derived low ionic content carbon–silica nanocomposite for green reinforced epoxy resin electronic packaging material
2017 · Ya-Yu Hsieh, Yun-Chih Tsai, et al. · Journal of the Taiwan Institute of Chemical Engineers · 32
Low-temperature Cu-to-Cu bonding using silver nanoparticles stabilised by saturated dodecanoic acid
2014 · Wen-Hua Li, Pei-Syuan Lin, et al. · Materials Science and Engineering A · 32
Mechanical properties of the hexagonal HoMnO3 thin films by nanoindentation
2010 · Cheng-Yo Yen, Sheng-Rui Jian, et al. · Journal of Alloys and Compounds · 32
Structural and elastic properties of Cu6Sn5 and Cu3Snfrom first-principles calculations
2009 · Jiunn Chen, Yi-Shao Lai, et al. · Journal of materials research/Pratt's guide to venture capital sources · 31
Evaluation of the nanoindentation behaviors of SiGe epitaxial layer on Si substrate
2009 · Bo-Ching He, Chun-Hu Cheng, et al. · Microelectronics Reliability · 24
Mechanical properties of InGaN thin films deposited by metal-organic chemical vapor deposition
2008 · Sheng-Rui Jian, Jason Shian-Ching Jang, et al. · Materials Chemistry and Physics · 24
Rice husk‐derived porous carbon/silica particles as green filler for electronic package application
2016 · Ya‐Yu Hsieh, Tsung‐Yi Chen, et al. · Journal of Applied Polymer Science · 18
On non-monotonicity of linear viscoelastic functions
2013 · Dao-Long Chen, Ping-Feng Yang, et al. · Mathematics and Mechanics of Solids · 17
Morphological, structural, and mechanical characterizations of InGaN thin films deposited by MOCVD
2007 · Ping-Feng Yang, Sheng-Rui Jian, et al. · Journal of Alloys and Compounds · 17
Using DMA to Simultaneously Acquire Young's Relaxation Modulus and Time-dependent Poisson's Ratio of a Viscoelastic Material
2014 · Dao-Long Chen, Tz-Cheng Chiu, et al. · Procedia Engineering · 15
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Nanomechanical characteristics of annealed Si/SiGe superlattices
2011 · Ming-Jhang Wu, Hua-Chiang Wen, et al. · Applied Surface Science · 15
The corrosion behavior of Ag alloy wire bond on Al pad in molding compounds of various chlorine contents under biased-HAST
2016 · Ying-Ta Chiu, Tzu-Hsing Chiang, et al. · International Conference on Electronics Packaging (ICEP) · 14
Nanoindentation of Mg-doped AlGaN thin films
2014 · Chih-Yen Huang, Pei-Ju Hsieh, et al. · Journal of Alloys and Compounds · 14
Works count: 89
Citation count: 1,532
H-index: 18
I10-index: 35
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