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Shari N. Farrens

Chemical Free Room Temperature Wafer To Wafer Direct Bonding
1995 · Shari N. Farrens, James R. Dekker, et al. · Journal of The Electrochemical Society · 151
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Cyclo-Olefin polymer direct bonding using low temperature plasma activation bonding
2005 · J. Mizuno, H. Ishida, et al. · International Conference on Solid-State Sensors, Actuators and Microsystems · 31
Aligned wafer bonding: A key to three dimensional microstructures
1991 · R. W. Bower, M. S. Ismail, et al. · Journal of Electronic Materials · 27
New Results on Plasma Activated Bonding of Imprinted Polymer Features for Bio MEMS Applications
2006 · P Kettner, R L Pelzer, et al. · Journal of Physics Conference Series · 26
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Cu to Cu interconnect using 3D-TSV and wafer to wafer thermocompression bonding
2010 · Cedric Huyghebaert, Jan Van Olmen, et al. · IEEE International Interconnect Technology Conference (IITC) · 22
Al-Ge Eutectic Wafer Bonding and Bond Characterization for CMOS Compatible Wafer Packaging
2010 · Sumant Sood, Shari Farrens, et al. · ECS Transactions · 21
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Wafer and Die Bonding Technologies for 3D Integration
2008 · Shari Farrens · MRS Proceedings · 19
An Atomic Force Microscopy Study on the Roughness of Silicon Wafers Correlated with Direct Wafer Bonding
1996 · Brian E. Roberds, Shari N. Farrens · Journal of The Electrochemical Society · 17
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A Kinetics Study of the Bond Strength of Direct Bonded Wafers
1994 · S. N. Farrens, C. E. Hunt, et al. · Journal of The Electrochemical Society · 15
Plasma activated wafer bonding for MEMS
2005 · V. Dragoi, S. Farrens, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 12
Low‐Temperature Wafer Bonding of Surfaces Using a Reactive Sputtered Oxide
1994 · James A. Folta, Charles E. Hunt, et al. · Journal of The Electrochemical Society · 11
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The Effects of Process‐Induced Defects on the Chemical Selectivity of Highly Doped Boron Etch Stops in Silicon
1994 · Cynthia A. Desmond, Charles E. Hunt, et al. · Journal of The Electrochemical Society · 11
Thin Wafer Handling Challenges and Emerging Solutions
2010 · Shari N. Farrens, Peter Bisson, et al. · ECS Transactions · 10
Wafer-Bonding Technologies and Strategies for 3D ICs
2008 · Shari Farrens · Integrated circuits and systems · 9
Cyclo-olefin Polymer Direct Bonding Using Low Temperature Plasma Activation Bonding
2006 · Jun Mizuno, S. Farrens, et al. · International Conference on MEMS, NANO, and Smart Systems · 7
The Genesis Process/sup TM/: a new SOI wafer fabrication method
2002 · W.G. En, I.J. Malik, et al. · IEEE International SOI Conference (SOI) · 7
Metal Surface Preparation for Wafer Bonding with Point of Use Wet Chemistries
2010 · Sumant Sood, Shari Farrens, et al. · ECS Transactions · 6
Metal Based Wafer Level Packaging
2008 · Shari Farrens · Wafer-Level Packaging Symposium · 6
Low temperature wafer bonding for microsystems applications
2005 · V. Dragoi, S. Farrens, et al. · CAS proceedings · 5
Advanced Anodic Bonding Processes For MEMS Applications
2003 · V. Dragoi, P. Lindner, et al. · MRS Proceedings · 5
Vertical Integration: A Confederacy of Alignment, Bonding, and Materials Technologies
2006 · Shari Farrens · MRS Proceedings · 4
Packaging methods and techniques for MOEMS and MEMS
2005 · Shari N. Farrens · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 4
Low Temperture Au-Au Thermal Compression Bonding of Thermally Mismatched Substrates
2008 · Shari Farrens, Sumant Sood · ECS Transactions · 2
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Atmospheric Plasma Conditions Compatible with Wafer to Wafer Bonding Strategies
2006 · Shari N. Farrens, Markus Gabriel · ECS Transactions · 2
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Beginning-to-end wafer bonding for advanced optical systems
2003 · Shari N. Farrens, Paul Lindner, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2
Works count: 52
Citation count: 439
H-index: 11
I10-index: 13
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