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Abdullah Fahim

Observed name: A. Fahim
Institution: NXP (United States)
ORCID: 0009-0001-9812-7215
Observed ORCID: 0009-0001-9812-7215
OpenAlex ID: A5112671328
High temperature creep response of lead free solders
2016 · Abdullah Fahim, Sudan Ahmed, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 47
Mechanical characterization of doped SAC solder materials at high temperature
2016 · Mahmudur R. Chowdhury, Sudan Ahmed, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 47
Optimization of mechanical and thermo-mechanical properties of epoxy and E-glass/epoxy composites using NH2-MWCNTs, acetone solvent and combined dispersion methods
2013 · S. Zainuddin, A. Fahim, et al. · Composite Structures · 43
Mechanical Characterization of Intermetallic Compounds in SAC Solder Joints at Elevated Temperatures
2018 · Abdullah Fahim, Sudan Ahmed, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 29
Effect of Different Thermal Cycling Profiles on the Mechanical Behavior of SAC305 Lead Free Solder
2020 · Mohammad Al Ahsan, S.M. Kamrul Hasan, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 24
Microstructural Evolution in SAC305 and SAC-Bi Solders Subjected to Mechanical Cycling
2018 · Md Mahmudur R. Chowdhury, Mohd Aminul Hoque, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 22
Evolution of the Mechanical Behavior of Lead Free Solders Exposed to Thermal Cycling
2019 · S. M. Kamrul Hasan, Abdullah Fahim, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 20
A Study of the Elastic Constants of 4H Silicon Carbide (4H-SiC)
2019 · Jun Chen, Abdullah Fahim, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 20
Mechanical Behavior Evolution of SAC+Bi Lead Free Solder Exposed to Thermal Cycling
2020 · S. M. Kamrul Hasan, Abdullah Fahim, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 15
Investigation on the Mechanical Behavior Evolution Occurring in Lead Free Solder Joints Exposed to Thermal Cycling
2020 · Abdullah Fahim, S M Kamrul Hasan, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 14
Nanoindentation Measurements of the Mechanical Properties of Individual Phases Within Lead Free Solder Joints Subjected to Isothermal Aging
2018 · Abdullah Fahim, Sudan Ahmed, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 14
Morphological and mechanical behavior of chemically treated jute‐PHBV bio‐nanocomposites reinforced with silane grafted halloysite nanotubes
2016 · Shaik Zainuddin, Abdullah Fahim, et al. · Journal of Applied Polymer Science · 14
Mechanical Property and Microstructure Evolution in SAC and $\text{SAC} +\mathrm{X}$ Lead Free Solders Exposed to Various Thermal Cycling Profiles
2021 · S. M. Kamrul Hasan, Abdullah Fahim, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 13
Nanoindentation Testing of SAC305 Solder Joints Subjected to Thermal Cycling Loading
2019 · Abdullah Fahim, S. M. Kamrul Hasan, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 12
Creep Behavior of Various Materials Within PBGA Packages Subjected to Thermal Cycling Loading
2020 · Abdullah Fahim, Kamrul Hasan, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 11
Effects of Thermal Cycling on the Mechanical and Microstructural Evolution of SAC305 Lead-Free Solder
2019 · S. M. Kamrul Hasan, Abdullah Fahim, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 11
Mechanical Property Evolution in SAC+Bi Lead Free Solders Subjected to Various Thermal Exposures
2021 · Mohammad Al Ahsan, S M Kamrul Hasan, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 10
Mechanical Behavior Evolution of SAC305 Lead Free Solder Joints under Thermal Cycling
2019 · Abdullah Fahim, Kamrul Hasan, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 10
Analysis of Mechanical Behavior of Hybrid SAC-LTS Joints Under Temperature Cycling With a Modified Garofalo Creep Model Based on Bi Concentration
2024 · Souvik Chakraborty, Yaxiong Chen, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 9
Modeling Deformation Behavior of Multiple Grained SAC305 Solder Joints
2020 · Debabrata Mondal, Abdullah Fahim, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 8
Damage Evolution in SAC Solder Alloys
2022 · Yaxiong Chen, Torsten Hauck, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 7
Comparison of Thermal Cycling Induced Mechanical Property Evolutions in Bulk Solder and Solder Joints
2021 · S M Kamrul Hasan, Abdullah Fahim, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 7
Evaluation of the Creep Response of Lead Free Solder Materials Subjected to Thermal Cycling
2020 · S. M. Kamrul Hasan, Abdullah Fahim, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 7
Nanomechanical Characterization of Various Materials within PBGA Packages Subjected to Thermal Cycling Loading
2020 · Abdullah Fahim, Kamrul Hasan, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 7
Nanomechanical Characterization of Intermetallic Compounds in Lead Free Solder Joints
2018 · Abdullah Fahim, Sudan Ahmed, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 7
Works count: 48
Citation count: 471
H-index: 13
I10-index: 18
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