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Yi‐Sheng Lin

An Area-Efficient Carry Select Adder Design by Sharing the Common Boolean Logic Term
2012 · I‐Chyn Wey, Cheng-Chen Ho, et al. · Lecture notes in computer science · 61
Synthesis, characterization, and thermomechanical properties of liquid crystalline epoxy resin containing ketone mesogen
2016 · Yi‐Sheng Lin, Steve Lien‐Chung Hsu, et al. · Polymer Engineering and Science · 23
The importance of p–n junction interfaces for efficient small molecule-based organic solar cells
2012 · Wei-Yang Chou, Jay Chang, et al. · Physical Chemistry Chemical Physics · 12
Reliability and Benchmark of 2.5D Non-Molding and Molding Technologies
2019 · Yu-Hsiang Hsiao, Che-Ming Hsu, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 10
Management of patients with advanced prostate cancer: Report of the Taiwan Advanced Prostate Cancer Consensus Conference 2022
2024 · Sheng-Chun Hung, Yi-Sheng Lin, et al. · Urological Science · 5
A Novel Detection Applied on Micro Defect in Bump Interface for 2.5DIC Package
2024 · Yi-Sheng Lin, Yu-Hsiang Hsiao, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 4
A Correlative Microscopic Workflow Powered by Artificial Intelligence to Accelerate Failure Analysis of Next-Generation Semiconductor Packages
2024 · Yu-Jen Chang, Cheng-Hsin Liu, et al. · Proceedings - International Symposium for Testing and Failure Analysis · 3
Application of Electro Optical Terahertz Pulse Reflectometry for Fault Localization and Defect Analysis
2017 · Yi-Sheng Lin, Yu-Hsiang Hsiao, et al. · Proceedings - International Symposium for Testing and Failure Analysis · 3
A Special Holding System for Large Package in 3D X-Ray Inspection
2024 · Chia-Ju Huang, Yu-Hsiang Hsiao, et al. · International Conference on Electronics Packaging (ICEP) · 2
3D X-Ray Microscope Applied on Fine-Line Inspection of Fan-Out Packages
2022 · Cheng-Hsin Liu, Yu-Jen Chang, et al. · International Conference on Electronics Packaging (ICEP) · 2
Key Technologies and Design Aspects for Advanced Focos Packaging
2025 · Cheng-Hsin Liu, Yi-Sheng Lin, et al. · European Microelectronics and Packaging Conference · 1
Novel Fault Isolation Methodology Applied on Nanoscale Defect in Fine Line RDL for Advanced Fan-Out Package
2025 · Yi-Sheng Lin, Cheng-Hsin Liu, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 1
Stress mitigation and defect passivation in CsPbI 2 Br solar cells via controlled oxidation and thermal stress control
2025 · Chih-Ching Kuo, Esra Alhabshi, et al. · Journal of Materials Chemistry A · 1
3D X-ray Microscope (XRM) Applied to Semiconductor Embedded in Substrate Defect Analysis
2021 · Cheng-Hsin Liu, Yu-Hsiang Hsiao, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 1
Investigation on the reliability risk for high density Fan-Out packages
2021 · Yu-Ting Lin, Yu-Ren Chang, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 1
Enhanced Fault Localization Approach for Advanced Packaging with RDL Interconnection Nano-Defects
2026 · Yi-Sheng Lin, Wiwy Wudjud, et al. · IEEE Electronic Components and Technology Conference (ECTC)
An Innovative Automated Tracing Method for Defect Identification in Advanced FOCoS-Bridge Package
2026 · Cheng-Hsin Liu, Yi-Sheng Lin, et al. · IEEE Electronic Components and Technology Conference (ECTC)
Electret Layer Design for Photowritable n-type Nonvolatile Organic Memory Devices
2025 · Po-Hsiang Fang, Yi-Sheng Lin, et al. · The Journal of Physical Chemistry C
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The Effect of Key Factors on 3D X-Ray Imaging for Fan-Out Package
2025 · Fan-Ju Hsiao, Yi-Sheng Lin, et al. · International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)
Lock-in Thermography judgment for short/leakage/high resistance defects in advanced Fan-Out packages
2023 · Yu-Ting Lin, Cheng-Hsin Liu, et al. · IEEE Electronics Packaging Technology Conference (EPTC)
Micro-Defect Failure Analysis in Fan-Out Package and Correspond to Finite Element Method (FEM) Simulation Results
2023 · Yu-Jen Chang, Yu-Hsiang Hsiao, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference
Universal Application of Load Board (L/B) and Socket with Direct Current Tester (DCT) for Various Packages
2021 · Yi-Sheng Lin, Yu-Hsiang Hsiao, et al. · Proceedings - International Symposium for Testing and Failure Analysis
Direct Current Tester (DCT) Applied to 2.5D IC Defect Analysis
2020 · Yi-Sheng Lin, Yu-Hsiang Hsiao, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference
Solution of Design Induced Reliability Risk for High Density Fan-Out packages
2019 · Yu-Ting Lin, Yi-Sheng Lin, et al. · IEEE Electronics Packaging Technology Conference (EPTC)
Study of Phase Shift of Lock-In Thermography and Its Application in 2.5D IC Package
2018 · Yu-Ting Lin, Brian Lai, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Works count: 26
Citation count: 130
H-index: 5
I10-index: 4
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