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G. Engelmann

Fabrication of high depth-to-width aspect ratio microstructures
1992 · G. Engelmann, O. Ehrmann, et al. · IEEE International Conference on Micro Electro Mechanical Systems (MEMS) · 55
Microactuators with moving magnets for linear, torsional or multiaxial motion
1992 · B. Wagner, W. Benecke, et al. · Sensors and Actuators A Physical · 39
Assembly and reliability of flip chip solder joints using miniaturized Au/Sn bumps
2004 · M. Hutter, F. Hohnke, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 31
Magnetically driven microstructures fabricated with multilayer electroplating
1995 · B. Löchel, A. Maciossek, et al. · Sensors and Actuators A Physical · 31
Fluxless flip chip assembly on rigid and flexible polymer substrates using the Au-Sn metallurgy
1994 · E. Zakel, J. Gwiasda, et al. · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 21
Calculation of shape and experimental creation of AuSn solder bumps for flip chip applications
2002 · M. Hutter, H. Oppermann, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 20
Development of a Fine Pitch Bumping Process
1990 · G. Engelmann, O. Ehrmann, et al. · Springer eBooks · 20
Precise flip chip assembly using electroplated AuSn20 and SnAg3.5 solder
2006 · M. Hutter, H. Oppermann, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 19
High depth to width aspect ratios in thick positive photoresist layers using near UV lithography
1992 · G. Engelmann, H. Reichl · Microelectronic Engineering · 19
Development and fabrication of a thin film thermo test chip and its integration into a test system for thermal interface characterization
2013 · M. AboRas, G. Engelmann, et al. · International Workshop on Thermal Investigations of ICs and Systems · 11
Development and evaluation of lead free reflow soldering techniques for the flip chip bonding of large GaAs pixel detectors on Si readout chip
2008 · M. Klein, M. Hutter, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 10
Effect of the Cu thickness on the stability of a Ni/Cu bilayer UBM of lead free microbumps during liquid and solid state aging
2005 · C. Jurenka, Jon Yeon Kim, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 10
Selectively released microstructures electroplated into thick positive photoresist
1993 · G Engelmann, O Ehrmann, et al. · Journal of Micromechanics and Microengineering · 10
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Accelerated reliability testing and modeling of Cu-plated through encapsulant vias (TEVs) for 3D-integration
2013 · B. Wunderle, J. Heilmann, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 6
Fabrication of a high-density MCM-D for a pixel detector system using a BCB/Cu technology
1999 · Topper, M, Dietrich, L, et al. · CERN Document Server (European Organization for Nuclear Research) · 6
Gold TSVs (Through Silicon Vias) for High-Frequency III-V Semiconductor Applications
2016 · K. Kroehnert, V. Glaw, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 5
High precision passive alignment flip chip assembly using self-alignment and micromechanical stops
2005 · M. Hutter, H. Opperrnann, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 5
W-band flip-chip VCO in thin-film environment
2005 · F.J. Schmuckle, F. Lenk, et al. · IEEE MTT-S International Microwave Symposium digest · 5
Copper filling of TSVs for interposer applications
2012 · N. Jurgensen, Q. H. Huynh, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 4
Reliability investigations of different bumping processes for flip chip and TAB applications
1996 · E. Jung, J. Kloeser, et al. · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 4
Reliability of Cu-plated through encapsulant vias (TEV) for 3D-integration
2013 · J. Heilmann, B. Wunderle, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 1
Progress in thermal characterisation methods and thermal interface technology within the “Nanopack” project
2009 · B. Wunderle, Mohamad Abo Ras, et al. · Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) · 1
Profile of the wafer level ECD gold bumps under variable parameters
2007 · X. M. Jing, G. Engelmann, et al. · Journal of Materials Science Materials in Electronics · 1
TAB-Kontaktierung für Sensoren/ Tape automated bonding for sensors
1989 · Ο. Ehrmann, G. Engelmann, et al. · tm - Technisches Messen
Works count: 32
Citation count: 346
H-index: 11
I10-index: 14
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