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Amkor Technology (Portugal)

Homepage: amkor.com
Alternate name: Amkor Technology Portugal SA
ROR: 01cgw9e63
OpenAlex ID: I4405254070
Heterogeneous Integration Challenges Within Wafer Level Fan-Out SiP for Wearables and IoT
2018 · Alberto Martins, Marcio Pinheiro, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 24
Meander-Line Monopole Antenna With Compact Ground Plane for a Bluetooth System-in-Package
2019 · Hugo M. Santos, Pedro Pinho, et al. · IEEE Antennas and Wireless Propagation Letters · 21
Wafer-Level Fan-Out For High-Performance, Low-Cost Packaging Of Monolithic Rf Mems/Cmos
2018 · Rameen Hadizadeh, Anssi Laitinen, et al. · International Wafer Level Packaging Conference (IWLPC) · 8
Determination of the Filler Distribution in an Epoxy Molding Compound Using High-Resolution X-Ray Computed Tomography
2021 · Emre Topal, Jurgen Gluch, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 6
Characterization of Electromigration Effects in RDL of Wafer Level Fan-In and Fan-Out Packaging Using a Novel Analysis Approach
2018 · Andre Cardoso, Sofia Martins, et al. · Electronic System-Integration Technology Conference (ESTC) · 5
FO-WLP multi-DOF inertial sensor for automotive applications
2018 · Heikki Kuisma, Andre Cardoso, et al. · Electronic System-Integration Technology Conference (ESTC) · 5
A Hybrid Panel Level Package (Hybrid PLP) Technology Based on a 650-mm x 650-mm Platform
2022 · Eoin O’Toole, José Luís Silva, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 4
A High-Power SOI-CMOS PA Module with Fan-Out Wafer-Level Packaging for 2.4 GHz Wi-Fi 6 Applications
2021 · P. Reynier, A. Serhan, et al. · Digest of papers - IEEE Radio Frequency Integrated Circuits Symposium · 4
The Systematic Study of Fan-Out Wafer Warpage Using Analytical, Numerical and Experimental Methods
2020 · Ghanshyam Gadhiya, Sven Rzepka, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 4
Fan-out wafer-level packaging as packaging technology for MEMS
2020 · Heikki Kuisma, André Cardoso, et al. · Elsevier eBooks · 4
Low-Density Fan-Out Heterogeneous Integration of MEMS Tunable Capacitor and RF SOI Switch
2019 · Rameen Hadizadeh, Anssi Laitinen, et al. · IMAPSource Proceedings · 2
Low-Density Fan-Out SiP for Wearables and IoT with Heterogeneous Integration
2018 · A. Martins, M. Pinheiro, et al. · International Wafer Level Packaging Conference (IWLPC) · 1
Virtual Prototyping, Design for Reliability, and Qualification for a Full SiP Product Portfolio of a FOWLP Line
2020 · Ghanshyam Gadhiya, Heikki Kuisma, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
List of contributors
2020 · Timo Aalto, Veli-Matti Airaksinen, et al. · Elsevier eBooks
Equipment and Process for eWLB
2019 · Chris Jones, Ricardo Gaio, et al. · Wiley eBooks
Wafer-Level Fan-Out for High-Performance, Low-Cost Packaging of Monolithic RF MEMS/CMOS
2018 · Rameen Hadizadeh, Anssi Laitinen, et al. · Wafer-Level Packaging Symposium
Low-Density Fan-Out SiP for Wearables and IoT with Heterogeneous Integration
2018 · A. Martins, M. Pinheiro, et al. · Wafer-Level Packaging Symposium
Works count: 17
Citation count: 368
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