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Micron (Taiwan)
Homepage:
tw.micron.com
Alternate names:
Micron Technology Taiwan,
美光
Parent institution:
Micron (United States)
ROR:
05fkhqk36
OpenAlex ID:
I4405261545
Analog Placement Based on Symmetry-Island Formulation
2009
·
Po-Hung Lin
, Yao-Wen Chang
, et al.
·
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
·
103
Blockchain technology adoption and business performance in large enterprises: A comparison of the United States and China
2023
·
Fang-Mei Tseng
, Ching-Wen Liang
, et al.
·
Technology in Society
·
75
Structural analysis and heavy metal adsorption of N-doped biochar from hydrothermal carbonization of Camellia sinensis waste
2020
·
Shasha Guo
, Yancheng Wang
, et al.
·
Environmental Science and Pollution Research
·
64
Prognostics and Health Management of Electronics: Fundamentals, Machine Learning, and the Internet of Things
2020
·
Chong Leong Gan
·
Life Cycle Reliability and Safety Engineering
·
56
Microfluidic synthesis of CsPbBr3/Cs4PbBr6 nanocrystals for inkjet printing of mini-LEDs
2021
·
Zhen Bao
, Jian-Wen Luo
, et al.
·
Chemical Engineering Journal
·
52
Critical Challenges with Copper Hybrid Bonding for Chip-to-Wafer Memory Stacking
2023
·
Wei Zhou
, Michael Kwon
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
45
A review of interconnect materials used in emerging memory device packaging: first- and second-level interconnect materials
2021
·
Yong Sheng Zou
, Chong Leong Gan
, et al.
·
Journal of Materials Science Materials in Electronics
·
45
Effect of metacognitive strategies and verbal-imagery cognitive style on biology-based video search and learning performance
2015
·
Pei-Lan Lei
, Chuen-Tsai Sun
, et al.
·
Computers & Education
·
42
One Bipolar Selector-One Resistor for Flexible Crossbar Memory Applications
2019
·
Dayanand Kumar
, Rakesh Aluguri
, et al.
·
IEEE Transactions on Electron Devices
·
33
Resolution enhanced light field near eye display using e‐shifting method with birefringent plate
2018
·
Jui‐Yi Wu
, Ping‐Yen Chou
, et al.
·
Journal of the Society for Information Display
·
32
Status and Needs of Power Electronics for Photovoltaic Inverters
2002
·
YU QIN
, NED MOHAN
, et al.
·
OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information)
·
30
PDF
Patient readiness for return to home: Discord between expectations and reality
1997
·
Michele Clark
, Margaret Steinberg
, et al.
·
Australian Occupational Therapy Journal
·
25
Solder joint reliability performance study and shear characterization of low-Ag SAC lead-free solders for handheld application
2024
·
Vance Liu
, Yung-Sheng Zou
, et al.
·
Materials Science in Semiconductor Processing
·
24
Evolution of epoxy molding compounds and future carbon materials for thermal and mechanical stress management in memory device packaging: a critical review
2023
·
Chong Leong Gan
, Min-Hua Chung
, et al.
·
Journal of Materials Science Materials in Electronics
·
24
Advanced Flip Chip Packaging
2023
·
Chong Leong, Gan
, Chen-Yu, Huang
·
Springer series in reliability engineering
·
24
End of the scaling theory and Moore's law
2016
·
Hiroshi Iwai
·
International Workshop on Junction Technology
·
24
In Vitro Evaluation of Inhalable Verapamil-Rifapentine Particles for Tuberculosis Therapy
2016
·
T. Parumasivam
, J. G. Y. Chan
, et al.
·
Molecular Pharmaceutics
·
22
Endometrial Cancer Detection Using a Cervical DNA Methylation Assay (MPap) in Women with Abnormal Uterine Bleeding: A Multicenter Hospital-Based Validation Study
2022
·
Kuo-Chang Wen
, Rui-Lan Huang
, et al.
·
Cancers
·
21
PDF
Plasmonic effects of two-dimensional indium-nanoparticles embedded within SiO2 anti-reflective coating on the performance of silicon solar cells
2020
·
Wen-Jeng Ho
, Hao-Yu Yang
, et al.
·
Applied Surface Science
·
20
Study on Package Strength of uMCP (Multichip Package) for Mobile Application through Three-Point Bending Test and Simulation
2020
·
Fa Xing Che
, Yeow Chon Ong
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
17
Improvement of InGaN/GaN light emitting diode performance with a nano-roughened p-GaN surface by excimer laser-irradiation
2005
·
Hung-Wen Huang
, C.C. Kao
, et al.
·
Materials Chemistry and Physics
·
17
Investigation of InGaN/GaN light emitting diodes with nano-roughened surface by excimer laser etching method
2006
·
Hung-Wen Huang
, Chih-Chiang Kao
, et al.
·
Materials Science and Engineering B
·
14
Mechanical Suite of Flexural Bending Method for Electronic Memory Packages
2021
·
Vance Liu
, Shams Arifeen
, et al.
·
IEEE International Conference on Sensors and Nanotechnology (SENNANO)
·
12
Enhancing Si/Organic Hybrid Solar Cells via Optimizing PEDOT:PSS Optical Properties and Anode Surface Contacts
2019
·
Hung-Chang Hsu
, Yi Lai
, et al.
·
IEEE Journal of Photovoltaics
·
12
Anisomeles indica Extracts and Their Constituents Suppress the Protein Expression of ACE2 and TMPRSS2 In Vivo and In Vitro
2023
·
Yu-Ru Chen
, Wen-Ping Jiang
, et al.
·
International Journal of Molecular Sciences
·
11
PDF
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Works count:
150
Citation count:
2,318
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