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NIHON SUPERIOR CO., LTD. (Japan)

Alternate names: NIHON SUPERIOR CO., LTD., 株式会社日本スペリア社
ROR: 04148t214
OpenAlex ID: I4405269390
Nickel-stabilized hexagonal (Cu, Ni)6Sn5 in Sn–Cu–Ni lead-free solder alloys
2008 · Kazuhiro Nogita, Tetsuro Nishimura · Scripta Materialia · 209
Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates
2009 · K. Nogita, C. M. Gourlay, et al. · JOM · 155
Ga-Based Alloys in Microelectronic Interconnects: A Review
2018 · Shiqian Liu, Keith Sweatman, et al. · Materials · 128
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Critical properties of Cu 6 Sn 5 in electronic devices: Recent progress and a review
2015 · D.K. Mu, S.D. McDonald, et al. · Current Opinion in Solid State and Materials Science · 125
Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends
2015 · Richard J. Coyle, Keith Sweatman, et al. · JOM · 106
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Harnessing heterogeneous nucleation to control tin orientations in electronic interconnections
2017 · Z. L. Ma, S. A. Belyakov, et al. · Nature Communications · 94
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The Influence of 0–0.1 wt.% Ni on the Microstructure and Fluidity Length of Sn-0.7Cu-xNi
2007 · Tina Ventura, Christopher M. Gourlay, et al. · Journal of Electronic Materials · 69
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Properties of CuGa2 Formed Between Liquid Ga and Cu Substrates at Room Temperature
2019 · Shiqian Liu, Stuart McDonald, et al. · Journal of Electronic Materials · 65
Phase stability and thermal expansion behavior of Cu6Sn5 intermetallics doped with Zn, Au and In
2013 · Guang Zeng, Stuart D. McDonald, et al. · Intermetallics · 63
Microstructure Control in Sn–0.7 mass%Cu Alloys
2005 · Kazuhiro Nogita, Jonathan Read, et al. · MATERIALS TRANSACTIONS · 53
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The influence of solder composition on the impact strength of lead-free solder ball grid array joints
2010 · H. Tsukamoto, T. Nishimura, et al. · Microelectronics Reliability · 52
Influence of bismuth on the solidification of Sn-0.7Cu-0.05Ni-xBi/Cu joints
2017 · S.A. Belyakov, J.W. Xian, et al. · Journal of Alloys and Compounds · 49
The effects of precipitation strengthening and solid solution strengthening on strain rate sensitivity of lead-free solders: Review
2018 · Shiqian Liu, Stuart McDonald, et al. · Microelectronics Reliability · 48
Inhibiting Cracking of Interfacial Cu6Sn5 by Ni Additions to Sn-based Lead-free Solders
2009 · Kazuhiro Nogita, Stuart D. McDonald, et al. · Transactions of The Japan Institute of Electronics Packaging · 47
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The influence of ageing on the stabilisation of interfacial (Cu,Ni)6(Sn,Zn)5 and (Cu,Au,Ni)6Sn5 intermetallics in Pb-free Ball Grid Array (BGA) solder joints
2016 · Guang Zeng, Stuart D. McDonald, et al. · Journal of Alloys and Compounds · 46
Precipitation and coarsening of bismuth plates in Sn–Ag–Cu–Bi and Sn–Cu–Ni–Bi solder joints
2018 · S. A. Belyakov, J. Xian, et al. · Journal of Materials Science Materials in Electronics · 45
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Characterisation of lithium-ion battery anodes fabricated via in-situ Cu6Sn5 growth on a copper current collector
2019 · Xin Fu Tan, Stuart D. McDonald, et al. · Journal of Power Sources · 44
Nanoindentation characterization of intermetallic compounds formed between Sn–Cu (–Ni) ball grid arrays and Cu substrates
2009 · Hideaki Tsukamoto, Zhigang Dong, et al. · Materials Science and Engineering B · 43
XRD study of the kinetics of β ↔ α transformations in tin
2013 · K. Nogita, C.M. Gourlay, et al. · The Philosophical Magazine A Journal of Theoretical Experimental and Applied Physics · 39
Shear and tensile impact strength of lead-free solder ball grid arrays placed on Ni (P)/Au surface-finished substrates
2010 · H. Tsukamoto, T. Nishimura, et al. · Materials Science and Engineering B · 39
Influence of Composition on the Morphology of Primary Cu6Sn5 in Sn-4Cu Alloys
2012 · Stuart McDonald, Kazuhiro Nogita, et al. · Journal of Electronic Materials · 32
The Effects of Temperature and Solute Diffusion on Volume Change in Sn-Bi Solder Alloys
2022 · Qichao Hao, Xin F. Tan, et al. · JOM · 28
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Ni segregation in the interfacial (Cu,Ni)6Sn5 intermetallic layer of Sn-0.7Cu-0.05Ni/Cu ball grid array (BGA) joints
2014 · Guang Zeng, Stuart D. McDonald, et al. · Intermetallics · 28
Effects of Phosphorus on Microstructure and Fluidity of Sn-0.7Cu-0.05Ni Lead-Free Solder
2008 · K. Nogita, C. M. Gourlay, et al. · MATERIALS TRANSACTIONS · 27
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Epitaxial growth of Cu6Sn5 formed at Sn-based lead-free solder/non-textured polycrystalline Cu plate interface
2009 · Hideaki Tsukamoto, Tetsuro Nishimura, et al. · Materials Letters · 25
Works count: 170
Citation count: 3,180
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