Tokyo Electron Kyushu Ltd (Japan)

Alternate names: Tokyo Electron Kyushu, Tokyo Electron Kyushu Ltd, 東京エレクトロン九州株式会社

ROR: 00a611q12

OpenAlex ID: I4405273698

1998 · G. Poddar, K. Chakrabarty, et al. · IEEE Transactions on Circuits and Systems I Fundamental Theory and Applications · 62

Pattern scaling with directed self assembly through lithography and etch process integration

2012 · Benjamen Rathsack, Mark Somervell, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 56

Contact hole shrink process using graphoepitaxial directed self-assembly lithography

2013 · Yuriko Seino, Hiroki Yonemitsu, et al. · Journal of Micro/Nanopatterning Materials and Metrology · 51

Development of micro-diamond tools through electroless composite plating and investigation into micro-machining characteristics

2009 · Heung-Kil Park, Hiromichi Onikura, et al. · Precision Engineering · 48

Effect of aluminium additions on wettability and intermetallic compound (IMC) growth of lead free Sn (2 wt. % Ag, 5 wt. % Bi) soldered joints

2014 · Hee Yul Lee, Ashutosh Sharma, et al. · Electronic Materials Letters · 36

Swelling and dissolution kinetics of poly(4-hydroxystyrene) in tetrabutylammonium hydroxide (TBAH) aqueous solutions studied by quartz crystal microbalance (QCM) method—in comparison with tetramethylammonium hydroxide (TMAH) aqueous solutions

2022 · Yuko Tsutsui Ito, Hitomi Betsumiya, et al. · Japanese Journal of Applied Physics · 32

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Effects of Pd addition on Au stud bumps/Al pads interfacial reactions and bond reliability

2004 · Hyoung-Joon Kim, Jong-Soo Cho, et al. · Journal of Electronic Materials · 32

0.5 μm Pitch Next Generation Hybrid Bonding with High Alignment Accuracy for 3D Integration

2023 · Christopher Netzband, Kevin Ryan, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 30

Nanopatterning of diblock copolymer directed self-assembly lithography with wet development

2012 · Makoto Muramatsu, Mitsuaki Iwashita, et al. · Journal of Micro/Nanopatterning Materials and Metrology · 30

Comparison of directed self-assembly integrations

2012 · Mark Somervell, Roel Gronheid, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 29

Iterative optimization of tail breaking force of 1 mil wire thermosonic ball bonding processes and the influence of plasma cleaning

2007 · J. Lee, M. Mayer, et al. · Microelectronics Journal · 28

Advances in directed self assembly integration and manufacturability at 300 mm

2013 · Benjamen Rathsack, Mark Somervell, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 27

Material-Mechanistic Interplay in SiCN Wafer Bonding for 3D Integration

2025 · Hayato Kitagawa, Ryosuke Sato, et al. · ACS Omega · 25

Multi-Physics Simulation of Wafer-to-Wafer Bonding Dynamics

2022 · Nathan Ip, Nima Nejadsadeghi, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 25

Sensitivity enhancement of chemically amplified resists and performance study using extreme ultraviolet interference lithography

2016 · Elizabeth Buitrago, Seiji Nagahara, et al. · Journal of Micro/Nanopatterning Materials and Metrology · 25

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High-volume manufacturing equipment and processing for directed self-assembly applications

2014 · Mark Somervell, Takashi Yamauchi, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 25

Self-Calibrating Infrared Thermometer for Low-Temperature Measurement

2011 · Tim Barry, Gary Fuller, et al. · IEEE Transactions on Instrumentation and Measurement · 25

Distortion Simulation for Direct Wafer-to-Wafer Bonding Process

2023 · Ip Nathan, Nima Nejadsadeghi, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 24

Dissolution dynamics of partially protected poly(4-hydroxystyrene) in tetraalkylammonium hydroxide aqueous solution

2023 · Hitomi Betsumiya, Yuko Tsutsui Ito, et al. · Japanese Journal of Applied Physics · 24

Evaluation of the Plasmaless Gaseous Etching Process

2007 · Yoshiya Hagimoto, Hajime Ugajin, et al. · Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena · 24

Frequency multiplication of lamellar phase block copolymers with grapho-epitaxy directed self-assembly sensitivity to prepattern

2012 · Roel Gronheid, Paulina A. Rincon Delgadillo, et al. · Journal of Micro/Nanopatterning Materials and Metrology · 23

Challenge toward breakage of RLS trade-off for EUV lithography by Photosensitized Chemically Amplified Resist (PSCAR) with flood exposure

2016 · Seiji Nagahara, Michael Carcasi, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 22

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Simulation analysis of directed self-assembly for hole multiplication in guide pattern

2014 · M. Muramatsu, T. Nakano, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 22

Contact hole shrink process using directed self-assembly

2012 · Yuriko Seino, Hiroki Yonemitsu, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 22

Advances and challenges in dual-tone development process optimization

2009 · Carlos Fonseca, Mark Somervell, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 22

Works count: 404

Citation count: 6,470