Author

Henny Volders

Observed name: H. Volders

Institution: IMEC

Observed institution: IMEC

OpenAlex ID: A5000428446

A new perspective of barrier material evaluation and process optimization

2009 · Larry Zhao, Zsolt Tikei, et al. · IEEE International Interconnect Technology Conference (IITC) · 35

Study of metal barrier deposition-induced damage to porous low-k materials

2011 · Larry Zhao, Henny Volders, et al. · Microelectronic Engineering · 26

Impact of “terminal effect” on Cu electrochemical deposition: Filling capability for different metallization options

2010 · Silvia Armini, Zsolt Tokei, et al. · Microelectronic Engineering · 23

CMP process optimization for improved compatibility with advanced metal liners

2010 · Nancy Heylen, Li Yunlong, et al. · IEEE International Interconnect Technology Conference (IITC) · 19

Demonstration of scaled 0.099µm2 FinFET 6T-SRAM cell using full-field EUV lithography for (Sub-)22nm node single-patterning technology

2009 · A. Veloso, S. Demuynck, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 15

In situ X-ray diffraction study of self-forming barriers from a Cu–Mn alloy in 100nm Cu/low-k damascene interconnects using synchrotron radiation

2009 · Christopher J. Wilson, Henny Volders, et al. · Microelectronic Engineering · 15

Air gap formation by UV-assisted decomposition of CVD material

2008 · M. Pantouvaki, A. Humbert, et al. · Microelectronic Engineering · 14

Materials characterization of WNxCy, WNx and WCx films for advanced barriers

2007 · H. Volders, Z. Tökei, et al. · Microelectronic Engineering · 14

Copper Plating on Resistive Substrates, Diffusion Barrier and Alternative Seed Layers

2010 · Aleksandar Radisic, Magi Nagar, et al. · ECS Transactions · 11

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Integration of 20nm half pitch single damascene copper trenches by spacer-defined double patterning (SDDP) on metal hard mask (MHM)

2010 · Yong Kong Siew, Janko Versluijs, et al. · IEEE International Interconnect Technology Conference (IITC) · 10

Metallization of sub-30 nm interconnects: Comparison of different liner/seed combinations

2009 · Laureen Carbonell, Henny Volders, et al. · IEEE International Interconnect Technology Conference (IITC) · 10

Barrier and seed repair performance of thin RuTa films for Cu interconnects

2010 · H. Volders, L. Carbonell, et al. · Microelectronic Engineering · 8

High yield sub-0.1µm2 6T-SRAM cells, featuring high-k/metal-gate finfet devices, double gate patterning, a novel fin etch strategy, full-field EUV lithography and optimized junction design & layout

2010 · N. Horiguchi, S. Demuynck, et al. · Symposium on VLSI Technology · 8

Dielectric Reliability of 50 nm Half Pitch Structures in Aurora® LK

2009 · Steven Demuynck, Honggun Kim, et al. · Japanese Journal of Applied Physics · 8

Integration and Dielectric Reliability of 30 nm Half Pitch Structures in Aurora® LK HM

2010 · Steven Demuynck, Craig Huffman, et al. · Japanese Journal of Applied Physics · 7

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Cu Resistivity Scaling Limits for 20nm Copper Damascene Lines

2007 · J. VanOlmen, S. List, et al. · IEEE International Interconnect Technology Conference (IITC) · 7

Texture characterization of Cu interconnects with different Ta-based sidewall diffusion barriers

2010 · Christopher J. Wilson, Chao Zhao, et al. · Microelectronic Engineering · 4

Advanced full-automatic inspection of copper interconnects

2012 · S. Takada, N. Ban, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2

Performance enhancement of Poly-Si/TiN/SiON based pMOSFETs by addition of an aluminum oxide (AlO) capping layer

2007 · R. Singanamalla, H. Yu, et al. · Microelectronic Engineering · 2

Dielectric Reliability of 50 nm 1/2 Pitch Structures in Auroraundefined LK

2008 · S. Demuynck, H. G. Kim, et al. · International Conference on Solid State Devices and Materials (SSDM) · 1

In situ X-ray diffraction study of self-forming barriers from a Cu-Mn alloy in 100 nm Cu/Iow-k damascene interconnects using synchrotron radiation

2010 · Christopher J. Wilson, Henny Volders, et al. · Newcastle University ePrints (Newcastle Univesity)

Link between silica-metal agglomeration and high porosity ultra-low k scratch formation during Chemical Mechanical Polishing

2010 · Nancy Heylen, Elisabeth Camerotto, et al. · IEEE International Interconnect Technology Conference (IITC)

Integration and dielectric reliability of 30nm ½ pitch structures in Aurora ®LK HM

2009 · S. Demuynck, C. Huffman, et al. · International Conference on Solid State Devices and Materials (SSDM)

Copper Plating on Resistive Substrates, Diffusion Barrier and Alternative Seed Layers

2009 · Aleksandar Radisic, Magi Nagar, et al. · ECS Meeting Abstracts

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In-situ study of self-forming barriers from a Cu-Mn alloy in 100 nm Cu/Low-k damascene interconnects using synchrotron radiation

2009 · C. M. Wilson, Henny Volders, et al.

Works count: 25

Citation count: 239

H-index: 10

I10-index: 11