Work

Integration of 20nm half pitch single damascene copper trenches by spacer-defined double patterning (SDDP) on metal hard mask (MHM)

Year: 2010

Type: conference-paper

Source: IEEE International Interconnect Technology Conference (IITC)

DOI: 10.1109/iitc.2010.5510743

Authors: Yong Kong Siew, Janko Versluijs, Eddy Kunnen, Ivan Ciofi, Wilfried Alaerts, Harold Dekkers, Henny Volders, Samuel Suhard, Andrew Cockburn, Erik Sleeckx, Els Van Besien, Herbert Struyf, Mireille Maenhoudt, Atif Noori, Deenesh Padhi, Kavita Shah, Virginie Gravey, Gerald Beyer

Institutions: IMEC, Applied Materials (United States)

Language: English

Topic: Advancements in Photolithography Techniques

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2124657266

FWCI: 2.567

Cites: 3

Cited by: 10

Related to: 10