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Silvia Armini

Observed names: Armini, S., Armini, Silvia, S. Armini
Institution: IMEC
ORCID: 0000-0003-0578-3422
Observed ORCID: 0000-0003-0578-3422
OpenAlex ID: A5020118291
Vapor-deposited zeolitic imidazolate frameworks as gap-filling ultra-low-k dielectrics
2019 · Mikhail Krishtab, Ivo Stassen, et al. · Nature Communications · 178
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3D stacked IC demonstration using a through Silicon Via First approach
2008 · J. Van Olmen, A. Mercha, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 139
Composite Polymer Core–Ceria Shell Abrasive Particles during Oxide CMP: A Defectivity Study
2008 · S. Armini, J. De Messemaeker, et al. · Journal of The Electrochemical Society · 101
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Copper plating for 3D interconnects
2010 · A. Radisic, O. Lühn, et al. · Microelectronic Engineering · 84
Integration challenges of copper Through Silicon Via (TSV) metallization for 3D-stacked IC integration
2010 · J. Van Olmen, C. Huyghebaert, et al. · Microelectronic Engineering · 79
Prediction of scratch generation in chemical mechanical planarization
2008 · A. Chandra, P. Karra, et al. · CIRP Annals · 69
Nanoscale Indentation of Polymer and Composite Polymer−Silica Core−Shell Submicrometer Particles by Atomic Force Microscopy
2007 · Silvia Armini, Ivan U. Vakarelski, et al. · Langmuir · 68
Capturing Wetting States in Nanopatterned Silicon
2013 · XiuMei Xu, Guy Vereecke, et al. · ACS Nano · 62
Bottom‐Up Engineering of Subnanometer Copper Diffusion Barriers Using NH2‐Derived Self‐Assembled Monolayers
2010 · Arantxa Maestre Caro, Silvia Armini, et al. · Advanced Functional Materials · 60
Composite Polymer-Core Silica-Shell Abrasive Particles during Oxide CMP
2007 · S. Armini, C. M. Whelan, et al. · Journal of The Electrochemical Society · 57
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Vapor-deposited octadecanethiol masking layer on copper to enable area selective Hf3N4 atomic layer deposition on dielectrics studied by in situ spectroscopic ellipsometry
2018 · Laurent Lecordier, Sebastiaan Herregods, et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 56
Electroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si vias
2013 · Fumihiro Inoue, Harold Philipsen, et al. · Electrochimica Acta · 56
Selective Ru ALD as a Catalyst for Sub-Seven-Nanometer Bottom-Up Metal Interconnects
2017 · Ivan Zyulkov, Mikhail Krishtab, et al. · ACS Applied Materials & Interfaces · 52
Void-Free Filling of HAR TSVs Using a Wet Alkaline Cu Seed on CVD Co as a Replacement for PVD Cu Seed
2010 · S. Armini, Z. El-Mekki, et al. · Journal of The Electrochemical Society · 40
Copper CMP with Composite Polymer Core–Silica Shell Abrasives: A Defectivity Study
2008 · S. Armini, C. M. Whelan, et al. · Journal of The Electrochemical Society · 40
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Enhanced barrier seed metallization for integration of high-density high aspect-ratio copper-filled 3D through-silicon via interconnects
2012 · Yann Civale, Silvia Armini, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 36
On the use of (3-trimethoxysilylpropyl)diethylenetriamine self-assembled monolayers as seed layers for the growth of Mn based copper diffusion barrier layers
2017 · A. Brady-Boyd, R. O’Connor, et al. · Applied Surface Science · 35
Impact of Plasma Pretreatment and Pore Size on the Sealing of Ultra-Low-k Dielectrics by Self-Assembled Monolayers
2014 · Yiting Sun, Mikhail Krishtab, et al. · Langmuir · 33
Selective electroless deposition of cobalt using amino-terminated SAMs
2019 · Ivan Zyulkov, Silvia Armini, et al. · Journal of Materials Chemistry C · 31
Area-Selective ALD of Ru on Nanometer-Scale Cu Lines through Dimerization of Amino-Functionalized Alkoxy Silane Passivation Films
2020 · Ivan Zyulkov, Viraj Madhiwala, et al. · ACS Applied Materials & Interfaces · 30
Composite Polymer Core–Silica Shell Abrasives: The Effect of the Shape of the Silica Particles on Oxide CMP
2008 · S. Armini, C. M. Whelan, et al. · Journal of The Electrochemical Society · 29
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Surface sealing using self-assembled monolayers and its effect on metal diffusion in porous low- k dielectrics studied using monoenergetic positron beams
2016 · Akira Uedono, Silvia Armini, et al. · Applied Surface Science · 27
Electroless Copper Bath Stability Monitoring with UV-VIS Spectroscopy, pH, and Mixed Potential Measurements
2012 · Fumihiro Inoue, Harold Philipsen, et al. · Journal of The Electrochemical Society · 27
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Sacrificial Self-Assembled Monolayers for the Passivation of GaAs (100) Surfaces and Interfaces
2016 · Daniel Cuypers, Claudia Fleischmann, et al. · Chemistry of Materials · 26
Cu Electrodeposition on Resistive Substrates in Alkaline Chemistry: Effect of Current Density and Wafer RPM
2011 · S. Armini · Journal of The Electrochemical Society · 26
Works count: 190
Citation count: 2,395
H-index: 25
I10-index: 72
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