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G. Bouche

The Complementary FET (CFET) for CMOS scaling beyond N3
2018 · J. Ryckaert, P. Schuddinck, et al. · Symposium on VLSI Technology · 276
Accurate modeling of trench isolation induced mechanical stress effects on MOSFET electrical performance
2003 · R.A. Bianchi, G. Bouche, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 147
Overcoming scaling barriers through design technology CoOptimization
2016 · Lars Liebmann, Jia Zeng, et al. · Symposium on VLSI Technology · 63
Bidirectional ferromagnetic spiral inductors using single deposition
2005 · B. Viala, S. Couderc, et al. · IEEE Transactions on Magnetics · 63
Integrated RF-MEMS switch based on a combination of thermal and electrostatic actuation
2004 · P. Robert, D. Saias, et al. · International Conference on Solid-State Sensors, Actuators and Microsystems · 63
A SiGe:C BiCMOS WCDMA zero-IF RF front-end using an above-IC BAW filter
2005 · J.F. Carpentier, A. Cathelin, et al. · Digest of technical papers/Digest of technical papers - IEEE International Solid-State Circuits Conference · 54
An above IC MEMS RF switch
2003 · D. Saias, P. Robert, et al. · IEEE Journal of Solid-State Circuits · 39
Texture of welded joints of 316L stainless steel, multi-scale orientation analysis of a weld metal deposit
2000 · G Bouche, J.L Béchade, et al. · Journal of Nuclear Materials · 31
Challenges of analog and I/O scaling in 10nm SoC technology and beyond
2014 · A. Wei, J. Singh, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 17
FeHfN and FeHfNO soft magnetic films for RF applications
2005 · S. Couderc, B. Viala, et al. · IEEE Transactions on Magnetics · 12
An above-IC RF-MEMS switch
2003 · D. Saias, S. Boret, et al. · Digest of technical papers/Digest of technical papers - IEEE International Solid-State Circuits Conference · 10
Investigations of stress sensitivity of 0.12 CMOS technology using process modeling
2002 · V. Senez, T. Hoffmann, et al. · Technical digest - International Electron Devices Meeting/Technical digest · 7
MEMS SiGe technologies for advanced wireless communications
2004 · J.P. Busquere, N. Do, et al. · Digest of papers - IEEE Radio Frequency Integrated Circuits Symposium · 6
High magnetization ferromagnetic spiral inductors using shape anisotropy
2005 · S. Couderc, B. Viala, et al. · IEEE International Magnetics Conference · 3
Quantitative Projections of the Cost Benefits of 3D Integration
2015 · Adam Beece, Dragomir Milojevic, et al. · IMAPSource Proceedings · 2
Bonding Pad Resistance. A Combined Approach
2001 · G. Bouche, R. Gonella, et al. · TechConnect Briefs · 2
MEMS Tunable Capacitors With Fragmented Electrodes and Electro-Thermal Actuation
2004 · A. Mehdaoui, F. Casset, et al. · Infoscience (Ecole Polytechnique Fédérale de Lausanne) · 1
Microstructural creep damage in welded joints of 316L stainless steel
1998 · G. Bouche, L. Allais, et al. · Materials at High Temperatures · 1
Impact of thermal treatments on the schottky barrier height reduction at the Ti-TiOx-Si interface for contact resistance reduction
2014 · Albert Lee, Abhijit Pethe, et al. · Silicon Nanoelectronics Workshop (SNW)
Piezoelectrically-controlled microswitch
2006 · Caruyer, G., Bouche, G., et al. · HAL
Dispositif de résonateur acoustique
2005 · Bouche, G., Caruyer, G., et al. · HAL
FeHfN and FeHfNO soft magnetic films for RF applications
2005 · S. Coudere, B. Viala, et al. · IEEE International Magnetics Conference
Tunable bimetallic microresonator formed on an isolated flexible beam
2004 · Bouche, G., Ancey, P., et al. · HAL
Composant électronique comprenant un résonateur et procédé de fabrication
2004 · Bouche, G., Smears, N., et al. · HAL
Procédé de réalisation d'un microrésonateur piézoélectique accordable
2004 · Robert, P., Caruyer, G., et al. · HAL
Works count: 34
Citation count: 797
H-index: 10
I10-index: 11
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