Author

Yuichiro Yamazaki

Observed name: Yuichiro YAMAZAKI

OpenAlex ID: A5111805998

Performance of EBeyeM for EUV mask inspection

2011 · Shinji Yamaguchi, Masato Naka, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 29

Edge placement error measurement in lithography process with die to database algorithm

2019 · Yoshishige Sato, Shang-Chieh Huang, et al. · Metrology, Inspection, and Process Control XXXVI · 22

Electron beam inspection system based on the projection imaging electron microscope

2001 · Motosuke Miyoshi, Yuichiro Yamazaki, et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 21

Evaluation of CD-SEM measurement uncertainty using secondary electron simulation with charging effect

2007 · Hideaki Abe, Akira Hamaguchi, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 13

Alignment system using voltage contrast images for low-energy electron-beam lithography

2001 · Tetsuro Nakasugi, Atsushi Ando, et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 10

Realizing more accurate OPC models by utilizing SEM contours

2020 · Chih-I Wei, Rajiv Sejpal, et al. · Metrology, Inspection, and Process Control XXXVI · 9

Contour extraction algorithm for edge placement error measurement using machine learning

2020 · Yosuke Okamoto, Shinichi Nakazawa, et al. · Metrology, Inspection, and Process Control XXXVI · 8

Development of an electron optical system using EB projection optics in reflection mode for EB inspection

2003 · Yuichiro Yamazaki, Ichirota Nagahama, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 7

Improvement of EPE measurement accuracy on ADI wafer, the method of using machine learning trained with CAD

2021 · Yosuke Okamoto, Shinichi Nakazawa, et al. · Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV · 6

Capability of model EBEYE M for EUV mask production

2012 · Masato Naka, Shinji Yamaguchi, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 6

Electron beam inspection system for semiconductor wafer based on projection electron microscopy

2004 · Tohru Satake, Nobuharu Noji, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 6

Topographic Contrast in the Linewidth Measurement with Scanning Electron Microscope

1986 · Motosuke MIYOSHI, Yuichiro YAMAZAKI · Journal of Electron Microscopy · 6

Voltage Contrast Defect Inspection of Contacts and Vias for Deep Quarter Micron Devices

1999 · Yuichiro Yamazaki, Hiroyuki Hayashi, et al. · Japanese Journal of Applied Physics · 5

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Utilization of active contour model with 3D-SEM simulation for see-through BSE image of high voltage SEM

2024 · Masahiro Oya, Yosuke Okamoto, et al. · Metrology, Inspection, and Process Control XXXVI · 4

Verification metrology system by using inline reference metrology

2014 · Hideaki Abe, Yasuhiko Ishibashi, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 4

Electron optics using multipole lenses for a low energy electron beam direct writing system

2002 · Yuichiro Yamazaki, Osamu Nagano, et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 4

Better prediction on patterning failure mode with hotspot aware OPC modeling

2021 · Chih-I Wei, Stewart Wu, et al. · Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV · 3

Massive metrology of 2D logic patterns on BEOL EUVL

2020 · Sayantan Das, Seul-Ki Kang, et al. · Metrology, Inspection, and Process Control XXXVI · 3

CD-SEM tool stability and tool-to-tool matching management using image sharpness monitor

2009 · Hideaki Abe, Yasuhiko Ishibashi, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 3

Use of 3D metrology for process control

2009 · Bart Rijpers, Jo Finders, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 3

Novel technology of automatic macro inspection for 32-nm node and best focus detection

2007 · Kazuhiko Fukazawa, Kazumasa Endo, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 3

Development of voltage contrast defect inspection technique for line monitoring 300mm ULSI hp90 logic contact layer

2005 · Hiroyuki Hayashi, Yuji Fukunaga, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 3

Measurement precision of CD-SEM for 65-nm technology node

2004 · Hideaki Abe, Hiroshi Motoki, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 3

Advanced pattern contour extraction function for see-through BSE images of high voltage SEM

2025 · Masahiro Oya, Yosuke Okamoto, et al. · Metrology, Inspection, and Process Control XXXVI · 2

Applications of large field of view e-beam metrology to contour-based optical proximity correction modeling

2023 · Chih-I Wei, Seulki Kang, et al. · Journal of Micro/Nanopatterning Materials and Metrology · 2

Works count: 45

Citation count: 202

H-index: 7

I10-index: 5