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Kang-Ill Seo
Observed names:
K. Seo,
Kang-ill Seo,
Seo Kang-ill
Institution:
IBM Research - Albany
Observed institutions:
Hewlett-Packard (United States),
Samsung (South Korea),
Stanford Synchrotron Radiation Lightsource,
Samsung Electronics (South Korea),
IBM Research - Albany,
Stanford University
show all 6
OpenAlex ID:
A5111862933
Surface Charge Density of Unpassivated and Passivated Metal-Catalyzed Silicon Nanowires
2006
·
Kang-ill Seo
, Shashank Sharma
, et al.
·
Electrochemical and Solid-State Letters
·
124
Improvement in High-$k$$(hboxHfO_2/hboxSiO_2)$Reliability by Incorporation of Fluorine
2006
·
K. Seo
, R. Sreenivasan
, et al.
·
IEEE Electron Device Letters
·
57
Chemical states and electronic structure of a HfO2∕Ge(001) interface
2005
·
Kang-Ill Seo
, Paul C. McIntyre
, et al.
·
Applied Physics Letters
·
51
PDF
Formation of an interfacial Zr-silicate layer between ZrO2 and Si through in situ vacuum annealing
2005
·
Kang-ill Seo
, Paul C. McIntyre
, et al.
·
Applied Physics Letters
·
40
Chemical states and electrical properties of a high-k metal oxide/silicon interface with oxygen-gettering titanium-metal-overlayer
2006
·
Kang-Ill Seo
, Dong-Ick Lee
, et al.
·
Applied Physics Letters
·
39
Novel stress-memorization-technology (SMT) for high electron mobility enhancement of gate last high-k/metal gate devices
2010
·
Kwan-Yong Lim
, Hyunjung Lee
, et al.
·
Technical digest - International Electron Devices Meeting/Technical digest
·
37
A novel tensile Si (n) and compressive SiGe (p) dual-channel CMOS FinFET co-integration scheme for 5nm logic applications and beyond
2016
·
Dong-il Bae
, Geumjong Bae
, et al.
·
Technical digest - International Electron Devices Meeting/Technical digest
·
34
Backside Power Distribution for Nanosheet Technologies Beyond 2nm
2024
·
Ruilong Xie
, Wonhyuk Hong
, et al.
·
IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)
·
26
Random Telegraph Noise in n-type and p-type silicon nanowire transistors
2008
·
Seungwon Yang
, Kyoung Hwan Yeo
, et al.
·
Technical digest - International Electron Devices Meeting/Technical digest
·
21
Fluorine incorporation at HfO2∕SiO2 interfaces in high-k metal-oxide-semiconductor gate stacks: Local electronic structure
2007
·
Jeong-Hee Ha
, Kang-ill Seo
, et al.
·
Applied Physics Letters
·
21
Improvement in high-k (HfO/sub 2//SiO/sub 2/) reliability by incorporation of fluorine
2006
·
Kang-ill Seo
, R. Sreenivasan
, et al.
·
Technical digest - International Electron Devices Meeting/Technical digest
·
17
Monolithic Stacked FET with Stepped Channels for Future Logic Technologies
2024
·
Chen Zhang
, SeungMin Song
, et al.
·
Technical digest - International Electron Devices Meeting/Technical digest
·
15
Interface Layers for High-k/Ge Gate Stacks: Are They Necessary?
2006
·
Paul McIntyre
, David Chi
, et al.
·
ECS Transactions
·
14
10nm FINFET technology for low power and high performance applications
2014
·
D. Guo
, H. Shang
, et al.
·
IEEE International Conference on Solid-State and Integrated Circuit Technology
·
10
Investigation of Fixed Oxide Charge and Fin Profile Effects on Bulk FinFET Device Characteristics
2013
·
Bomsoo Kim
, Dong-Il Bae
, et al.
·
IEEE Electron Device Letters
·
6
Highly manufacturable 1 Gb NAND flash using 0.12 μm process technology
2002
·
Jung-Dal Choi
, Seong-Soon Cho
, et al.
·
Technical digest - International Electron Devices Meeting/Technical digest
·
5
Next-generation logic design architecture for vertical-transport nanosheets
2023
·
Biswanath Senapati
, Jeongho Do
, et al.
·
DTCO and Computational Patterning
·
1
Integrated simulation of equipment and topography for plasma etching in the DRM reactor
2002
·
Won-Young Chung
, Jae-Joon Oh
, et al.
·
International Conference on Simulation of Semiconductor Processes and Devices
·
1
Backside Contact Resistivity Reduction for Nanosheet Technologies Beyond 2nm by Backside Nanosecond Laser Anneal Without Impacting the Frontside Cu BEOL
2026
·
Ruilong Xie
, Kevin Brew
, et al.
·
IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)
Block-Level Design Optimization for Sub-100-nm Cell Height Libraries with Stacked Transistor
2025
·
N. Lanzillo
, J. Mazza
, et al.
·
Technical digest - International Electron Devices Meeting/Technical digest
Predictive Simulations and Experimental Study of AlN Bonding for Better Thermal Dissipation in BSPDN
2025
·
Sarabjot Singh
, Sangshin Jang
, et al.
·
IEEE International Interconnect Technology Conference (IITC)
5nm論理およびそれ以上の応用のための新しい引張Si(n)と圧縮SiGe(p)二重チャネルCMOS FinFET共積分スキーム【Powered by NICT】
2016
·
Bae Dong-il
, Bae Geumjong
, et al.
·
IEEE Conference Proceedings
Interface Layers for High-k/Ge Gate Stacks: Are They Necessary?
2006
·
Paul McIntyre
, David Chi
, et al.
·
ECS Meeting Abstracts
PDF
Characterization, engineering, and reliability of nano-scale high-k dielectrics and semiconductors interfaces
2006
·
Kang-Ill Seo
Chemical states and electronic structure of a HfO(-2) / Ge(001) interface
2005
·
Kang-ill Seo
, Paul C. McIntyre
, et al.
·
OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information)
PDF
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Works count:
25
Citation count:
519
H-index:
13
I10-index:
14
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