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C. Madden
Observed names:
C. J. Madden,
C.J. Madden,
Chris Madden
Institution:
Ayar Labs (United States)
Observed institutions:
Hewlett-Packard (United States),
Rambus (United Kingdom),
Rambus (United States),
Ayar Labs (United States),
Stanford University
OpenAlex ID:
A5111882215
Simulation and Analysis of Random Decision Errors in Clocked Comparators
2009
·
J. Kim
, B.S. Leibowitz
, et al.
·
IEEE Transactions on Circuits and Systems I Regular Papers
·
143
An Error-free 1 Tbps WDM Optical I/O Chiplet and Multi-wavelength Multi-port Laser
2021
·
M. Wade
, E. Anderson
, et al.
·
Optical Fiber Communication Conference
·
67
Clocking and circuit design for a parallel I/O on a first-generation CELL processor
2005
·
K. Chang
, S. Pamarti
, et al.
·
Digest of technical papers/Digest of technical papers - IEEE International Solid-State Circuits Conference
·
57
Investigating the Impact of Supply Noise on the Jitter in Gigabit I/O Interfaces
2007
·
Ralf Schmitt
, Hai Lan
, et al.
·
IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
·
53
Hyperabrupt-doped GaAs nonlinear transmission line for picosecond shock-wave generation
1989
·
C. J. Madden
, R. A. Marsland
, et al.
·
Applied Physics Letters
·
52
A Tri-Modal 20-Gbps/Link Differential/DDR3/GDDR5 Memory Interface
2012
·
Kambiz Kaviani
, Ting Wu
, et al.
·
IEEE Journal of Solid-State Circuits
·
41
A 6.4-Gb/s Near-Ground Single-Ended Transceiver for Dual-Rank DIMM Memory Interface Systems
2013
·
Michael Bucher
, Ravi T. Kollipara
, et al.
·
IEEE Journal of Solid-State Circuits
·
35
Generation of 3.5-ps fall-time shock waves on a monolithic GaAs nonlinear transmission line
1988
·
C.J. Madden
, M.J.W. Rodwell
, et al.
·
IEEE Electron Device Letters
·
31
5.12 Tbps Co-Packaged FPGA and Silicon Photonics Interconnect I/O
2022
·
Kaveh Hosseini
, Edwin Kok
, et al.
·
IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)
·
27
A 12.8-Gb/s/link Tri-Modal Single-Ended Memory Interface
2012
·
Amir Amirkhany
, Jason Wei
, et al.
·
IEEE Journal of Solid-State Circuits
·
25
Advanced Modeling and Accurate Characterization of a 16 Gb/s Memory Interface
2009
·
W.T. Beyene
, C. Madden
, et al.
·
IEEE Transactions on Advanced Packaging
·
25
Monolithic integrated circuits for mm-wave instrumentation
2002
·
R.A. Marsland
, C.J. Madden
, et al.
·
Technical digest -- IEEE Compound Semiconductor Integrated Circuit Symposium
·
22
A 0.4mW/Gb/s 16Gb/s near-ground receiver front-end with replica transconductance termination calibration
2012
·
Kambiz Kaviani
, Amir Amirkhany
, et al.
·
Digest of technical papers/Digest of technical papers - IEEE International Solid-State Circuits Conference
·
21
Design and characterization of a 12.8GB/s low power differential memory system for mobile applications
2009
·
Dan Oh
, Sam Chang
, et al.
·
IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
·
21
Jitter Amplification Considerations for PCB Clock Channel Design
2007
·
Chris Madden
, Sam Chang
, et al.
·
IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
·
21
130 GHz GaAs monolithic integrated circuit sampling head
1989
·
R. A. Marsland
, V. Valdivia
, et al.
·
Applied Physics Letters
·
21
A novel 75 GHz InP HEMT dynamic divider
2002
·
C.J. Madden
, D.R. Snook
, et al.
·
Technical digest -- IEEE Compound Semiconductor Integrated Circuit Symposium
·
18
Jitter modeling in statistical link simulation
2008
·
Yu Chang
, Dan Oh
, et al.
·
IEEE International Symposium on Electromagnetic Compatibility
·
17
Characterization of random decision errors in clocked comparators
2008
·
B. S. Leibowitz
, J. Kim
, et al.
·
Custom Integrated Circuits Conference
·
16
Prediction of System Performance Based on Component Jitter and Noise Budgets
2007
·
Dan Oh
, Frank Lambrecht
, et al.
·
IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
·
16
Generation of 7.8 ps electrical transients on a monolithic nonlinear transmission line
1988
·
M.J.W. Rodwell
, C.J. Madden
, et al.
·
Electronics Letters
·
15
A 0.4-mW/Gb/s Near-Ground Receiver Front-End With Replica Transconductance Termination Calibration for a 16-Gb/s Source-Series Terminated Transceiver
2013
·
Kambiz Kaviani
, Amir Amirkhany
, et al.
·
IEEE Journal of Solid-State Circuits
·
14
A 6.4Gb/s near-ground single-ended transceiver for dual-rank DIMM memory interface systems
2013
·
K. Kaviani
, M. Bucher
, et al.
·
Digest of technical papers/Digest of technical papers - IEEE International Solid-State Circuits Conference
·
13
A 4.1-pJ/b, 16-Gb/s Coded Differential Bidirectional Parallel Electrical Link
2012
·
Amir Amirkhany
, Kambiz Kaviani
, et al.
·
IEEE Journal of Solid-State Circuits
·
13
In-situ characterization of 3D package systems with on-chip measurements
2010
·
Dan Oh
, Hai Lan
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
13
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Works count:
57
Citation count:
921
H-index:
17
I10-index:
29
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