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Larry Zhuang
Observed names:
L. Zhuang,
Larry L. Zhuang
Institution:
IBM Research - Albany
Observed institutions:
IBM (United States),
GlobalFoundries (United States),
IBM Research - Albany
OpenAlex ID:
A5113572485
22nm High-performance SOI technology featuring dual-embedded stressors, Epi-Plate High-K deep-trench embedded DRAM and self-aligned Via 15LM BEOL
2012
·
S. Narasimha
, P. Chang
, et al.
·
Technical digest - International Electron Devices Meeting/Technical digest
·
95
Scaling of 32nm low power SRAM with high-K metal gate
2008
·
H. S. Yang
, R. Wong
, et al.
·
Technical digest - International Electron Devices Meeting/Technical digest
·
53
High performance 32nm SOI CMOS with high-k/metal gate and 0.149µm 2 SRAM and ultra low-k back end with eleven levels of copper
2006
·
B. Greene
, Qingqing Liang
, et al.
·
Symposium on VLSI Technology
·
39
Fundamental investigation of negative tone development (NTD) for the 22nm node (and beyond)
2011
·
Guillaume Landie
, Yongan Xu
, et al.
·
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
·
26
Lithographic benefits and mask manufacturability study of curvilinear masks
2018
·
Alexander Wei
, Wei Guo
, et al.
·
SPIE Photomask Technology Conference
·
21
Monolithic Stacked FET with Stepped Channels for Future Logic Technologies
2024
·
Chen Zhang
, SeungMin Song
, et al.
·
Technical digest - International Electron Devices Meeting/Technical digest
·
15
Subresolution assist features impact and implementation in extreme ultraviolet lithography for next-generation beyond 7-nm node
2018
·
Vivian Wei Guo
, Fan Jiang
, et al.
·
Journal of Micro/Nanopatterning Materials and Metrology
·
9
OMOG mask topography effect on lithography modeling of 32nm contact hole patterning
2010
·
Lei Yuan
, Wenzhan Zhou
, et al.
·
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
·
5
SRAF requirements, relevance, and impact on EUV lithography for next-generation beyond 7nm node
2018
·
Wei Guo
, Fan Jiang
, et al.
·
Extreme Ultraviolet (EUV) Lithography
·
3
Feasibility study of machine learning modeling for full chip optical proximity correction
2022
·
Yuping Cui
, Jing Xue
, et al.
·
DTCO and Computational Patterning
·
1
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Works count:
10
Citation count:
267
H-index:
7
I10-index:
6
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