Author

Daniel Jin

OpenAlex ID: A5113715582

GaN HEMT thermal behavior and implications for reliability testing and analysis

2008 · Daniel S. Green, Bharath Vembu, et al. · Physica status solidi. C, Conferences and critical reviews/Physica status solidi. C, Current topics in solid state physics · 34

Thermal and Mechanical Characterization of High Power GaN Packages

2011 · Don Willis, Gary Gu, et al. · IMAPSource Proceedings · 1

Solder Joint Reliability Study for Wafer Level Packages on Flexible and Rigid Boards

2013 · Gary Gu, Jon Chadwick, et al. · IMAPSource Proceedings

Accurate Prediction of Thermal Resistance of FET by Detailed Modeling of Heat Generation and Backend Stackup

2012 · Qun Wan, Don Willis, et al. · IMAPSource Proceedings

Drop Test Simulation for the Component-Level Reliability of Module Packages

2010 · Yu Gu, Daniel Jin · IMAPSource Proceedings

Works count: 5

Citation count: 35

H-index: 1

I10-index: 1