Work

Improved aluminum plug process for submicron via filling

Year: 1994

Type: conference-paper

Source: Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE

DOI: 10.1117/12.186052

Authors: Hong Yang, Yih-Shung Lin, Loc Nguyen, De-Dui Liao, J. Worley, Greg Smith, Fu-Tai Liou

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2007289745

FWCI: 2.571

Cites:

Cited by: 1

Related to: 10