Fabrication of three-dimensional IC using `cumulatively bonded IC' (CUBIC) technology
Year: 1990
Type: conference-paper
Source: Symposium on VLSI Technology
Authors: Y. Hayashi, S. Wada, K. Kajiyana, K. Oyama, R. Koh, S. Takahashi, T. Kunio
Institution: NEC (Japan)
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2010531567