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The performances of different overlay mark types at 65nm node on 300-mm wafers

Year: 2005

Type: conference-paper

Source: Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE

DOI: 10.1117/12.598424

Authors: H. T. Tseng, Ling-Chieh Lin, I. H. Huang, Benjamin S. Lin, Chin-Chou K. Huang, Chien-Jen Huang

Institutions: United Microelectronics (Taiwan), KLA (United States)

Language: English

Topic: Advancements in Photolithography Techniques

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2010594599

FWCI:

Cites:

Cited by: 1

Related to: 10