Work

Process Integration Issues with Spike, Flash and Laser Anneal Implementation for 90 and 65 NM Technologies

Year: 2006

Type: conference-paper

Source: International Conference on Advanced Thermal Processing of Semiconductors

DOI: 10.1109/rtp.2006.367984

Authors: Th. Feudel, M. Horstmann, L. Herrmann, M. Herden, M. Gerhardt, D. Greenlaw, P. Fisher, J. Kluth

Institution: IBM (United States)

Language: English

Topic: Semiconductor materials and devices

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2013127650

FWCI: 2.638

Cites: 5

Cited by: 10

Related to: 10