Work

Application of compact HCI model to prediction of process effect in 28FDSOI technology

Year: 2014

Type: conference-paper

Source: IEEE International Integrated Reliability Workshop final report

DOI: 10.1109/iirw.2014.7049513

Authors: W. Arfaoui, X. Federspiel, A. Bravaix, P. Mora, A. Cros, D. Roy

Institutions: STMicroelectronics (France), Institut des Matériaux, de Microélectronique et des Nanosciences de Provence

Language: English

Topic: Semiconductor materials and devices

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2014077853

FWCI: 1.606

Cites: 11

Cited by: 16

Related to: 10