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Pascal Mora
Observed names:
Mora Pascal,
Mora, P.,
P. Mora
Institution:
STMicroelectronics (France)
Observed institutions:
Centre National de la Recherche Scientifique,
STMicroelectronics (France),
Institut des Matériaux, de Microélectronique et des Nanosciences de Provence,
Institut de Microélectronique, Electromagnétisme et Photonique
ORCID:
0000-0001-5047-2821
Observed ORCID:
0000-0001-5047-2821
OpenAlex ID:
A5055085547
Energy-driven Hot-Carrier model in advanced nodes
2014
·
W. Arfaoui
, X. Federspiel
, et al.
·
IEEE International Reliability Physics Symposium proceedings
·
44
Impact of the gate-stack change from 40nm node SiON to 28nm High-K Metal Gate on the Hot-Carrier and Bias Temperature damage
2013
·
A. Bravaix
, Y. Mamy Randriamihaja
, et al.
·
IEEE International Reliability Physics Symposium proceedings
·
35
HCI/BTI coupled model: The path for accurate and predictive reliability simulations
2014
·
F. Cacho
, P. Mora
, et al.
·
IEEE International Reliability Physics Symposium proceedings
·
30
Experimental analysis of defect nature and localization under hot-carrier and bias temperature damage in advanced CMOS nodes
2013
·
W. Arfaoui
, X. Federspiel
, et al.
·
IEEE International Integrated Reliability Workshop final report
·
17
Application of compact HCI model to prediction of process effect in 28FDSOI technology
2014
·
W. Arfaoui
, X. Federspiel
, et al.
·
IEEE International Integrated Reliability Workshop final report
·
16
Frequency dependence of TDDB & PBTI with OTF monitoring methodology in high-k/metal gate stacks
2014
·
A. Bezza
, M. Rafik
, et al.
·
IEEE International Reliability Physics Symposium proceedings
·
16
New insight on the frequency dependence of TDDB in high-k/metal gate stacks
2013
·
A. Bezza
, M. Rafik
, et al.
·
IEEE International Integrated Reliability Workshop final report
·
11
28nm UTBB FDSOI product reliability/performance trade-off optimization through body bias operation
2015
·
P. Mora
, X. Federspiel
, et al.
·
IEEE International Reliability Physics Symposium proceedings
·
10
Modeling of hot carrier injection across technology scaling
2014
·
F. Cacho
, W. Arfaoui
, et al.
·
IEEE International Integrated Reliability Workshop final report
·
9
Challenges and opportunity in performance, variability and reliability in sub-45nm CMOS technologies
2011
·
F. Arnaud
, L. Pinzelli
, et al.
·
Microelectronics Reliability
·
9
Hot-Carrier Injection Degradation in Advanced CMOS Nodes: A Bottom-Up Approach to Circuit and System Reliability
2014
·
Vincent Huard
, Florian Cacho
, et al.
·
Springer eBooks
·
6
Reliability issues related to Fast Charge Loss Mechanism in Embedded Non Volatile Memories
2006
·
Pascal Mora
, Sophie Renard
, et al.
·
IEEE International Integrated Reliability Workshop final report
·
6
Physical understanding of low frequency degradation of NMOS TDDB in High-k metal gate stack-based technology. Implication on lifetime assessment
2015
·
A. Bezza
, M. Rafik
, et al.
·
IEEE International Reliability Physics Symposium proceedings
·
4
Multi-Vibrational Hydrogen Release: A Dielectric Breakdown Model for Ultra-thin SiO2/SiON and High-K Stack
2009
·
Guillaume C. Ribes
, Pascal Mora
, et al.
·
ECS Transactions
·
4
PDF
(Invited) Effect of SOI Substrate on CMOS Devices Reliability
2014
·
Xavier Federspiel
, Wafa Arfaoui
, et al.
·
ECS Transactions
·
2
New insight on high-k/metal gate reliability modeling for providing guidelines for process development
2013
·
M. Rafik
, G. Ribes
, et al.
·
IEEE International Reliability Physics Symposium proceedings
·
1
A self heating test structure using poly resistors and P/sup +//N diodes to characterize anomalous charge transfers in embedded flash memories
2005
·
P. Mora
, P. Waltz
, et al.
·
IEEE International Conference on Microelectronic Test Structures (ICMTS)
·
1
(Invited) Effect of SOI Substrate on CMOS Devices Reliability
2014
·
Xavier Federspiel
, Wafa Arfaoui
, et al.
·
ECS Meeting Abstracts
Contact etch stop a-SixNy:H layer: a key factor for single polysilicon flash memory data retention.
2008
·
Beylier, G.
, Benoit, D.
, et al.
·
HAL
New Characterization Methodology of Borderless Silicon Nitride Charge Kinetic using C(V) Hysteresis Loops
2007
·
Gaelle Beylier
, Bruyere Sylvie
, et al.
·
ECS Transactions
PDF
Étude et caractérisation de la fiabilité de cellules mémoire non volatiles pour des technologies CMOS et BICMOS avancées
2007
·
Pascal Mora
·
OpenGrey (Institut de l'Information Scientifique et Technique)
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Works count:
21
Citation count:
221
H-index:
9
I10-index:
8
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