Work

A metallurgical prescription for electromigration (EM) reliability improvment in scaled-down, Cu dual damascene interconnects

Year: 2006

Type: conference-paper

Source: IEEE International Interconnect Technology Conference (IITC)

DOI: 10.1109/iitc.2006.1648654

Authors: M. Tada, M. Abe, H. Ohtake, N. Furutake, T. Tonegawa, K. Motoyama, M.K. Itos, M. Ueki, T. Takeuchi, S. Saito, K. Fujii, M. Sekine, Y. Hayashi, M. Tohara

Institution: NEC (Japan)

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2027436591

FWCI: 3.814

Cites: 6

Cited by: 6

Related to: 10