Work

BIST Method for Die-Level Process Parameter Variation Monitoring in Analog/Mixed-Signal Integrated Circuits

Year: 2007

Type: conference-paper

Abstract: This paper reports a new built-in self-test scheme for analog and mixed-signal devices based on die-level process monitoring. The objective of this test is not to replace traditional specification-based tests, but to provide a reliable method for early identification of excessive process parameter variations in production tests that allows quickly discarding of the faulty circuits. Additionally, the possibility of on-chip process deviation monitoring provides valuable information, which is used to guide the test and to allow the estimation of selected performance figures. The information obtained through guiding and monitoring process variations is re-used and supplement the circuit calibration

Source: Design, Automation, and Test in Europe

DOI: 10.1109/date.2007.364477

Authors: Amir Zjajo, Manuel J. Barragan Asian, Jose Pineda de Gyvez

Institutions: Philips (Netherlands), Instituto de Microelectrónica de Sevilla, Universidad de Sevilla, Eindhoven University of Technology

Language: English

Topic: VLSI and Analog Circuit Testing

Subfield: Hardware and Architecture

Field: Computer Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: green

OpenAlex ID: W2098549513

FWCI: 1.252

Cites: 12

Cited by: 32

Related to: 10