Work

45nm-node Interconnects with Porous SiOCH-Stacks, Tolerant of Low-Cost Packaging Applications

Year: 2007

Type: conference-paper

Source: IEEE International Interconnect Technology Conference (IITC)

DOI: 10.1109/iitc.2007.382384

Authors: N. Inoue, M. Tagami, F. Itoh, H. Yamamoto, T. Takeuchi, S. Saito, N. Furutake, M. Ueki, M. Tada, T. Suzuki, Y. Hayashi

Institutions: NEC (Japan), Sumitomo Bakelite (Japan)

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2139883727

FWCI: 8.845

Cites:

Cited by: 8

Related to: 10