Enabling technologies for 3D chip stacking
Year: 2008
Type: conference-paper
Authors: Patrick Leduc, Lea Di Cioccio, Barbara Charlet, Maxime Rousseau, Myriam Assous, David Bouchu, Anne Roule, Marc Zussy, Pierric Gueguen, Antonio Roman, Olivier Rozeau, Michel Heitzmann, Jean-Pierre Nieto, Laurent Vandroux, Paul-Henri Haumesser, Remi Quenouillere, Alain Toffoli, Pierre Sixt, Sylvain Maitrejean, Laurent Clavelier, Nicolas Sillon
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2162828974