Work

Full-Field Through-Chip IR-Thermography-based Quality Testing & Failure Analysis on Electroplated Aluminium Interconnects for Cryogenic Applications in Ion-Trap Quantum Computers

Year: 2024

Type: conference-paper

Source: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

DOI: 10.1109/eurosime60745.2024.10491500

Authors: D. May, B. Wunderle, I. Cirulis, S. Braun, U. Zschenderlein, J. Heilmann, R. Pantou, R. Schacht, R. Rzepka, M. Abo Ras, S. Kurth, H. Kuhn

Institutions: Chemnitz University of Technology, Fraunhofer Institute for Electronic Nano Systems, Brandenburg University of Technology Cottbus-Senftenberg

Language: English

Topic: Integrated Circuits and Semiconductor Failure Analysis

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4394596772

FWCI: 0.668

Cites: 21

Cited by: 1

Related to: 10