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Hung‐Chun Kuo

Observed names: H. C. Kuo, Hung-Chun Kuo, Hung-chun Kuo
ORCID: 0000-0003-1707-7138
Observed ORCID: 0000-0003-1707-7138
OpenAlex ID: A5019134208
Ultra High Density IO Fan-Out Design Optimization with Signal Integrity and Power Integrity
2019 · Keng Tuan Chang, Chih-Yi Huang, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 37
Advanced Fanout Packaging Technology for Hybrid Substrate Integration
2022 · Lihong Cao, Teck Chong Lee, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 30
Development of Novel Fine Line 2.1 D Package with Organic Interposer Using Advanced Substrate-Based Process
2018 · Wei-Chung Chen, Chiu-Wen Lee, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 24
A D-Band Magnetoelectric Dipole Antenna-in-Package (AiP) Implemented on BT-Based Organic Substrate
2022 · Hung-Chun Kuo, Chih-Wen Kuo, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 23
Development of novel fine line 2.1 D package with organic interposer using advanced substrate-based process
2018 · Wei-Chung Chen, Chiu-Wen Lee, et al. · IEEE CPMT Symposium Japan (ICSJ) · 20
A Low-Cost Antenna-in-Package Solution for 77GHz Automotive Radar Applications
2019 · Cheng-Yu Ho, Sheng-Chi Hsieh, et al. · International Conference on Electronics Packaging (ICEP) · 17
Effective low‐frequency EMI conformal shielding for system‐in‐package (SiP) modules
2023 · Hung‐Chun Kuo, Chih‐Wen Kuo, et al. · Microwave and Optical Technology Letters · 11
Integrated Design Ecosystem for Chiplets Heterogeneous Integration and Chip-to-Chip Interconnects in Advanced Packaging Technology
2024 · Lihong Cao, Chen-Chao Wang, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 7
Creative Design and Structure Applied to Chiplets Packaging
2023 · Chen-Chao Wang, Chih-Yi Huang, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 7
A Study on Alternative Substrate for FCBGA
2022 · Li-Chieh Hung, Po-I Wu, et al. · IEEE CPMT Symposium Japan (ICSJ) · 6
Extraction of Complex Permittivity of Dielectrics on Package from W-band to D-band
2021 · Yi-Ting Lin, Hung-Chun Kuo, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 6
Shielding effectiveness modeling and measurement of multiple layers conformal shielding on system-in-package (SiP) module
2016 · Chih-Wen Kuo, Hung-Chun Kuo, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 6
Technology Enhancements on Focos-Bridge for Emerging Trends in High-Performance Computing (HPC) and Artificial Intelligence (AI)
2025 · Teck Chong Lee, Chung Hao Chen, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 5
A Low-Cost Antenna-in-Package (AiP) for D-Band Application
2023 · Hung-Chun Kuo, Po-I Wu, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 5
High impedance design and investigation using TDR for fine lines on high density organic substrate
2017 · Hung-Chun Kuo, Fu-Chen Chu, et al. · International Conference on Electronics Packaging (ICEP) · 5
Ultra High Density Package Design and Electrical Analysis in High Performance Computing Application
2019 · Tsun-Lung Hsieh, Hung-Chun Kuo, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 4
Electrical performance analysis of fine line on high density package substrate
2015 · Hung-Chun Kuo, Ming-Fong Jhong, et al. · IEEE CPMT Symposium Japan (ICSJ) · 4
Signal Integrity Analysis of UCIe Channel in FOCoS Advanced Package
2024 · Chiung-Ying Kuo, Po-Chih Pan, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 3
Lowering coupling noise between chips in System-in-Package (SiP) module using compartment shielding
2016 · Fu-Chen Chu, Hung-Chun Kuo, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 3
Utilizing plating bar structure to enhance passive equalizer compensation technique
2014 · Chen-Chao Wang, Hung-Chun Kuo, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 2
A Compact D -Band Cavity-Backed Slot Antenna in Package (AiP) Implemented on Low-Cost Organic Substrate
2026 · Yi-Ting Lin, Hung-Chun Kuo, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 1
A Highly Integrated AiP Design for 6G Applications
2024 · PO-I Wu, Hung-Chun Kuo, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 1
Signal Integrity Analysis and Design for HBM3 on Silicon-Based 2.5D Packaging
2024 · Li-Chieh Hung, Cheng-Yu Tsai, et al. · IEEE CPMT Symposium Japan (ICSJ) · 1
Crosstalk Mitigation for High Speed SerDes Applications on FCBGA Package
2023 · Li-Chieh Hung, Hung-Chun Kuo, et al. · IEEE CPMT Symposium Japan (ICSJ) · 1
Mitigate Package Level Crosstalk Using Tabbed Design
2023 · Cheng-Yu Tsai, Hung-Chun Kuo, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 1
Works count: 45
Citation count: 238
H-index: 7
I10-index: 7
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